Page 401 - Sami Franssila Introduction to Microfabrication

380 Introduction to Microfabrication

REFERENCES AND RELATED READINGS Lu, J.-Q. et al: 3D integration using wafer bonding, Advanced
Metallization Conference 2000 (3–5 October 2000, San
Baliga, J.B.: The future of power semiconductor device Diego), paper V3.
technology, Proc. IEEE, 89 (2001), 822; (special issue on Machida, K. et al: A novel semiconductor capacitive sensor for
power electronics technology). a single-chip fingerprint sensor/identifier LSI, IEEE TED, 48
Baltes, H. & O. Brand: CMOS-based microsensors and pack- (2001), 2273.
aging, Sensors Actuators, A92 (2001), 1. Railkar, T.A. et al: A critical review of CVD diamond for
Chui, B.W. et al: Low-stiffness silicon cantilevers with inte- electronic applications, Crit. Rev. Solid State Mater. Sci., 25
grated heaters and piezoresistive sensors for high density (2000), 163–277.
AFM thermomechanical data storage, J. MEMS, 7 (1998), Renaud, Ph.: Composite photopolymer microstructures: from
69. planar to 3D devices, Transducers ’03 (2003), p. 991.
Gardner, J.W., V.V. Varadan & O.O. Awadelkarim: Microsen- Sutton M.S. & J. Talghader: Micromachined negative thermal
sors, MEMS and Smart Devices, John Wiley & Sons, 2001. expansion films, Proc. Transducers ’03 (2003), 1148.
K¨ arkk¨ ainen A.H.O. et al: Photolithographic processing of Tong, H.D. et al: A hydrogen separation module, Transducers
hybrid glasses for microoptics, Journal of Lightwave Tech- ’03 (2003), p. 1742.
nology, 21 (2003), 614. Tzeng, S.C. & W.P. Ma: Study of flow and heat transfer
Lee, S.T. & Y. Lifshitz: The road to diamond wafers, Nature, characteristics and LIGA fabrication of microspinnerets, J.
31(7) 2003, p. 500. Micromech. Microeng., 13 (2003), 670.
Lee, Y. et al: High-performance poly-Si TFTs on plastic van Kessel, P.F. et al: A MEMS-based projection display,
substrates using a nano-structured separation layer approach, Proc. IEEE, 86 (1998), 1687.
IEEE EDL, 24 (2003), 19. Xue, M. et al: A self-assembled conductive device for direct
Lin, T.-Y. et al: Fabrication of low-stress plasma enhanced DNA identification in integrated microarray based system,
chemical vapor deposition silicon carbide films, Jpn. J. Appl. IEDM, 2002, 207.
Phys., 39 (2000), 6663.