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                   198                       MEMS and Microstructures in Aerospace Applications


                   of silicon with microscopic wicking surfaces etched into the surfaces. The fluid path
                   in the pipe contains finely etched lines about as deep as fingerprints and 60 mm
                   wide. SNL’s microheat pipes use methanol as cooling fluid. Methanol or other types
                   of fluids will circulate inside the pipes and remove heat from, for example, a heat
                   source such as a distributed battery. As is true for all heat pipes, the operation of the
                   microheat pipes involves the phase change of the working fluid to maximize its heat
                   transfer capability. This provides an added advantage of maintaining the hardware
                   in a constant temperature range. Once heated, vaporized methanol flows by con-
                   vection to the heat sink where it gives up its heat, condenses back to liquid phase,
                   and returns to the hot end. The heat and cooling of the working fluid completes the
                   evaporation and condensation cycle of the microheat pipes.
                       One basic issue in spacecraft thermal control is heat dissipation from densely
                   packaged electronic parts assembled in electronic boxes mounted on a spacecraft
                   platform. 16  In solving thermal related problems, SNL has actively engaged in the
                   development of MEMS-based heat pipes for future space application. To further
                   ensure MEMS advances for defense, aerospace, and commercial applications, SNL
                   has established several cooperative research and development agreements with
                   aerospace companies. Preliminary results demonstrated that the development of
                   microheat pipes is steady and relatively successful. As shown in the literature,
                   microheat pipes range in size from 1 mm in diameter and 60 mm in length to 30
                   mm in diameter and 10 mm in length. The methods currently used to fabricate
                   microheat pipes with hydraulic diameters on the order of 20 to 150 mm into silicon
                   or gallium arsenide wafers are also available. 17

                   9.4.5 MEMS PUMPED LIQUID COOLING SYSTEM
                   Pumped fluid loops are active thermal control systems. A simplified loop consists of
                   a pumping device, a heat exchanger, and a space radiator. Pumped fluid loops are
                   devices operated under the principle of forced liquid convective cooling. Cooling
                   is accomplished when the working fluid absorbs excess heat and transports it to a
                   heat sink. The loops can effectively maintain temperatures even when the spacecraft
                   dissipates high power or operates under environmental extremes. For example,
                   NASA’s Mars Pathfinder used a mechanically pumped single-phase cooling loop
                   with Freon-11 as a working fluid to achieve a cooling power capacity of 90 to
                   180 W. Chip level temperature control by micropumped loop device was reported
                   by Pettigrew et al. 18  In this work, an evaporator, condenser, reservoir, and liquid
                   and vapor lines were etched into the silicon wafer, while the glass wafer serves as a
                   cover plate into which grooves were etched for capillary pumping. The device had a
                   1   2 mm evaporator and was capable of operating at a constant 1008C.
                       As spacecraft get ever smaller, many thermal control devices will be required to
                   miniaturize. Aiming at future deep space science exploration, the NASA Jet Pro-
                   pulsion Laboratory (JPL) has investigated a MEMS cooling system for micro- or
                                19
                   nanospacecraft. Although the current pumped liquid cooling system is designed to
                   transfer large amounts of thermal energy between two locations on a spacecraft, it is
                   not capable of handling heat transfer in high power density applications. Power





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