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Microelectromechanical Systems and Microstructures in Aerospace 353

reliability requirements. Devices that fail any screening test shall be identified,
separated, or removed.

16.3.2 ASSEMBLY AND PACKAGING QUALIFICATION/SCREENING REQUIREMENTS
Particular attention must be paid to devices after delivery and release as they are in
their most unprotected and vulnerable state. Therefore, an entire chapter (Chapter
13) of this book deals with ‘‘Handling and Contamination Control.’’ The handling
and storage procedures must be in place before receipt of any microsystem. Use
only facilities with a strong background in microelectronic packaging for space
flight hardware to perform assembly, and packaging activity. Using known steps
and tests from the military specification world is useful.

16.3.2.1 MIL-PRF-38535 Integrated Circuits (Microcircuits) Manufacturing,
General Specification

MIL-PRF-38535 specification establishes the general performance requirements for
IC or microcircuits and the quality and reliability assurance requirements, which
must be met for their acquisition. The intent of this specification is to allow the
device manufacturer the flexibility to implement best commercial practices to the
maximum extent possible while still providing product that meets military perform-
ance needs. Detailed requirements, specific characteristics of microcircuits, and
other provisions that are sensitive to the particular use intended will be specified in
the device specification. Quality assurance requirements outlined in MIL-PRF-
38535 are for all microcircuits built on a manufacturing line, which is controlled
through a manufacturer’s quality management (QM) program and has been certified
and qualified in accordance with requirements herein. Several levels of product
assurance including radiation hardness assurance (RHA) are provided for in this
specification. MIL-PRF-38535 is often used in connection with MIL-STD-883
microcircuit test methods.

16.3.2.2 MIL-STD-883 Test Method Standard, Microcircuits
This standard establishes uniform methods, controls, and procedures for testing
microelectronic devices suitable for use within military and aerospace electronic
systems including basic environmental tests. These tests determine resistance to
deleterious effects of natural elements and conditions surrounding military and
space operations. The standard covers other controls and constraints necessary for a
uniform level of quality and reliability suitable to the intended applications of those
devices. For this standard, the term ‘‘devices’’ includes such items as monolithic,
multichip, film and hybrid microcircuits, microcircuit arrays, and the elements that
form circuits and arrays. This standard applies only to microelectronic devices.
However, MEMS devices in microcircuit packages may test in accordance with
MIL-STD-883. Figure 16.1 provides a suggested test and inspection flow derived
from MIL-PRF-38535 and microcircuit test methods MIL-STD-883 test methods for
microelectronics.

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