Page 10 - Mechanics of Microelectromechanical Systems
P. 10

PREFACE


                 This book  offers a  comprehensive coverage to  the  mechanics of
          microelectromechanical systems (MEMS),  which are  analyzed  from a
          mechanical  engineer’s  viewpoint as devices that  transform an  input form of
          energy, such as thermal,  electrostatic, electromagnetic or optical, into  output
          mechanical  motion (in the case of  actuation)  or  that  can operate  with the
          reversed functionality (as in sensors) and convert an external stimulus, such as
          mechanical  motion, into  (generally) electric energy. The  impetus of  this
          proposal stems from the perception that such an approach might contribute to
          a more  solid  understanding of  the  principles  governing the  mechanics of
          MEMS, and would  hopefully  enhance the  efficiency of  modeling and
          designing reliable  and  desirably-optimized microsystems. The  work
          represents an  attempt at both  extending and deepening the mechanical-based
          approach to  MEMS  in  the static domain  by  providing simple,  yet  reliable
          tools  that are  applicable to  micromechanism  design through current
          fabrication technologies.
                 Lumped-parameter stiffness and  compliance properties  of  flexible
          components are  derived both analytically (as  closed-form  solutions) and  as
          simplified (engineering)  formulas.  Also studied are the  principal  means of
          actuation/sensing and their integration into the overall microsystem. Various
          examples of MEMS are studied in order to better illustrate the presentation of
          the different modeling principles and algorithms.
                 Through its  objective,  approach and scope,  this  book offers a  novel
          and systematic insight into the  MEMS  domain and  complements existing
          work in the  literature addressing part of  the  material  developed herein.
          Essentially, this book provides a database of stiffness/compliance models for
          various spring-type flexible connectors that transmit the mechanical motion in
          MEMS,  as well  as of  the  various forces/moments  that are  involved in
          microtransduction. In  order to  predict their  final  state,  the microsystems  are
          characterized by  formulating,  solving and  analyzing the  static equilibrium
          equations, which incorporate spring, actuation and sensing effects.
                 Chapter 1  gives  a succinct,  yet comprehensive review of the  main
          tools enabling stiffness/compliance characterization of MEMS as  it  lays the
          foundation of further  developments in this  book. Included are basic topics
          from  mechanics of  materials and  statics  such as  load-deformation,  stress-
          strain or structural members. Presented are the Castigliano’s theorems as basic
          tools in  stiffness/compliance calculation.  Straight and  curved line  elements
          are studied by explicitly formulating their compliance/stiffness characteristics.
          Composite micromembers,  such  as sandwiched,  serial, parallel, and hybrid
          (serial-parallel) are also treated in detail, as well as thin plates and shells. All
          the theoretical apparatus presented in this chapter is illustrated with examples
          of MEMS  designs.
                 Chapter 2 is dedicated to characterizing the main flexible components
          that are encountered in MEMS and which enable mechanical mobility through
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