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Silicon Debug and Test  355

        Review Questions

         1. Why do all designs find bugs post-silicon?
         2. What are some common causes of logic bugs?
         3. What is the difference between deadlock and livelock?
         4. How does a stored-response tester work?
         5. Describe five ways in which a design bug could be corrected.
         6. Describe three types of post-silicon validation tests.
         7. How are FIB edits used in silicon debug?
         8. What types of silicon bugs are suitable for errata?
         9. What is the purpose of burn-in testing?
        10. What is the advantage of performing E-test and wafer probe testing?
        11. [Discussion] What are the possible impacts of creating a processor
            design without DFT circuits? Would it be possible to validate a
            design using DFT circuits and then manufacture a version without
            them? What would be the advantages to and problems with this
            approach?
        12. [Discussion] This text states that all microprocessors have errata.
            Is this true for other complex products? In what markets besides
            computers and under what circumstances are errata considered
            acceptable? When are they not acceptable?
        13. [Discussion] Of all the steps in microprocessor design which is most
            impacted by the scaling of Moore’s law?

        Bibliography

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          Devices with an EOS Fail.” Proceedings of 12th IPFA, Singapore: 2005. [Describes an
          example of silicon debug using IREM.]
        Balachandran, Hari et al. “Facilitating Rapid First Silicon Debug.” International Test
          Conference, Winchester, England: 2002.
        Bentley, Bob. “High Level Validation of Next-Generation Microprocessors.” 7th IEE
          International High-Level Design Validation and Test Workshop, Cannes, France: October
          2002.
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                                           ®
        Bentley, Bob. “Validating the Intel Pentium 4 Microprocessor.” Design Automation
          Conference, Las Vegas, NV: 2001.
                                          ®
        Carbine, Adrian and Derek Feltham. “Pentium Pro Processor Design for Test and Debug.”
          International Test Conference, Washington, DC: 1997.
        Chandrakasan, Anantha et al. Design of High-Performance Microprocessor Circuits. New
          York: Wiley-IEEE Press, 2001.
        Chang, Jonathan et al. “A130-nm Triple-Vt 9-MB Third-Level On-Die Cache for the 1.7-GHz
                ®
          Itanium 2 Processor.” IEEE Journal of Solid State Circuits, vol. 40, 2005, pp. 195–203.
          [Describes the redundancy used to improve yields with an extremely large cache.]
        Dervisoglu, Bulent. “Design for Testability: It Is Time to Deliver It for Time-to-Market.”
          International Test Conference, Atlantic City, NJ: 1999.
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