Page 388 - A Practical Guide from Design Planning to Manufacturing
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358   Glossary

        Assembly language  Human-readable text mnemonics for the machine lan-
        guage instructions of a computer architecture. Unlike high-level programming
        languages, most assembly language instructions correspond to a single machine
        language instruction.

        Associativity  The number of locations where a single memory address may
        be stored in a cache memory.
        ATA   Advanced technology attachment.
        ATE   Automatic test equipment.
        Atmospheric pressure chemical vapor deposition (APCVD)  Deposition of
        material through the chemical reaction of gases at full atmospheric pressure.
        Full pressure allows high deposition rates but make it more difficult to create
        uniform high-quality layers.
        ATPG   Automatic test pattern generation.
        ATX   Advanced technology extended.
        Automatic test equipment (ATE)  Machines designed specifically to test inte-
        grated circuits by providing electrical stimulus and monitoring the response.
        Automatic test pattern generation (ATPG)  The generation by software of the
        minimal set of test vectors required to fully test a given circuit typically through
        the use of scan sequentials.
        Balanced technology extended (BTX)  A form factor specifying the physical
        size and power connectors of a motherboard. The BTX standard is designed to
        allow easier cooling of components than the older ATX standard.

        Ball grid array (BGA)  An integrated circuit package using multiple rows of
        solder balls on all four sides as leads. Common for chips to be used in portable
        applications.
        Basic input output system (BIOS)  Low-level routines programmed into a
        ROM chip on a PC motherboard. The BIOS initializes the PC upon start-up and
        provides subroutines that allow applications and the OS to interact with the
        motherboard hardware without knowledge of the details of its design.
        BBUL   Bumpless build-up layer.

        BCD   Binary coded decimal.
        BESOI   Bonded etched back silicon on insulator.
        BGA   Ball grid array.
        Big endian  A memory addressing format that assumes for numbers more
        than 1 byte in size, the lowest memory address is the most significant byte (the
        big end) of the number. See little endian.
        BIM   Binary intensity mask.
        Binary coded decimal (BCD)  A binary encoding scheme that represents each
        digit of a decimal number using four binary digits. This requires more bits than
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