Page 402 - A Practical Guide from Design Planning to Manufacturing
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372   Glossary

        NMOS    N-type metal oxide semiconductor field-effect transistor.
        NOR   A logic function that is false if any of its inputs are true.
        Northbridge  The chipset component responsible for communicating with the
        processor and the highest bandwidth components, typically main memory and
        the graphics adapter. Also called the memory controller hub (MCH) or graphics
        memory controller hub (GMCH).
        NOT   A logic function that is true if its input is false.
        nm   Nanometer.
        N-type metal oxide semiconductor (NMOS)  A MOSFET with N-type source
        and drain terminals in a P-well. An NMOS transistor will conduct when the gate
        voltage is high.
        N-type semiconductor  Semiconductor with donor dopants added to create
        negative free charge carriers.
        OPC   Optical proximity correction.
        Opcode   The bits of an encoded machine language instruction determining the
        operation to be performed.

        Operating system (OS)  The program responsible for loading and running
        other programs.
        Optical proximity correction (OPC)  Changes made to a photolithography
        mask to compensate for the wave nature of light.

        OR   A logic function that is true if any of its inputs is true.
        OS   Operating system.
        Out-of-order execution  Executing instructions in a different order than spec-
        ified by the software in order to improve performance. The processor must make
        sure that the program results are unchanged by this reordering.
        PA-RISC  Precision architecture reduced instruction set computing. A RISC
        computer architecture created by Hewlett Packard.
        Parity bits  Redundant bits added to memory stores to allow misread bytes to
        be detected.
        PCA   Printed circuit assembly.
        PCB   Printed circuit board.
        PCI  Peripheral component interconnect.

        PDIP  Plastic dual in-line package.
        PECVD   Plasma-enhanced chemical vapor deposition.
        Performance bug  A design flaw that causes an integrated circuit to spend more
        cycles than intended executing a program but still produce the logically correct
        result.
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