Page 399 - A Practical Guide from Design Planning to Manufacturing

Glossary 369

KGD Known good die.
Kilobyte (kB) 2 10 or approximately 1000 bytes.
K-map Karnaugh map.

Known good die (KGD) A die that has been fully tested and proven to be
functional before packaging.
Land grid array (LGA) An integrated circuit package using multiple rows of
flat circular metal lands on all four sides as leads.

Land side cap (LSC) Decoupling capacitors placed on the opposite side of the
package substrate as the die.
Laser voltage probing (LVP) Reading the transient voltage waveforms of an
integrated circuit using the reflection of a laser beam.
Latch A storage sequential circuit that based on a clock signal either passes
its input directly to its output or holds a previous value.
Latchup A positive feedback between N-type and P-type wells, causing large
amounts of current to flow beneath the surface of a chip. The only way to return
the chip to normal operation is to switch its power off. The possibility of latchup
is reduced by frequent well taps, or using epi or SOI wafers.
Layout density The number of components per area drawn in layout. Because
large area means larger die cost, it is important to achieve the highest layout
density possible.
Layout design rules Rules restricting the widths and spacings of the different
materials drawn in layout to allow for reliable manufacturing.
Layout The task of drawing the individual layers of material that will make
up the components needed for an integrated circuit.
Lead An electrical connection from a packaged integrated circuit to the printed
circuit board.
Lead design A design project that reuses almost nothing from previous
designs.
Lead pitch The spacing between leads on an integrated circuit package, com-
monly between 1 and 0.4 mm.
Leadframe A strip of leads for multiple plastic packages. After die are attached
and encapsulated the individual packages will be cut free of the leadframe.
Leakage power The power consumed by an integrated circuit due to sub-
threshold and gate leakage. This power is independent of clock frequency.
LGA Land grid array.
Linear region The MOSFET region of operation where gate voltage forms an
inversion layer at both ends of the channel. Current is determined by the volt-
age at the source, gate, and drain terminals. See cutoff and saturation regions.