Page 396 - A Practical Guide from Design Planning to Manufacturing
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366   Glossary

        Flip-chip (FC)  A method for creating electrical connections between a die and
        package by placing solder bumps on the face of the die and then turning the die
        facedown on the package substrate and applying heat and/or pressure. See wire
        bond package.

        Flip-flop (FF)  A storage sequential circuit that captures the data on its input
        at each new rising edge of a clock signal.
        Floating-point execution unit (FPU)  The portion of a microprocessor respon-
        sible for computation involving floating-point numbers.
        Floating point  Numbers formatted in scientific notation as a fraction and an
        exponent.
        Flux  Chemicals that help solder flow and create good electrical connections by
        preventing the formation of oxides.
        Focused ion beam (FIB) edit  Altering an integrated circuit design by cutting
        or depositing structures using a FIB process. This allows design changes to be
        tested before new masks are made.
        FPGA   Field programmable gate array.
        FPU   Floating-point execution unit.

        FR4   Flame retardant material type 4.
        Front-side bus (FSB)  A bus connecting the processor and the chipset.
        Fully associative cache  A cache memory where the data from any memory
        address can be stored in any location in the cache.
        Gate leakage  Leakage current through the gate oxide of a MOSFET.
        Gate oxide  The layer of insulation separating the gate terminal and the
        channel of a MOSFET.
        Gate terminal  The MOSFET terminal controlling whether current will flow
        between the source and drain.
        Gigabyte (GB)  2 30  or approximately 1 billion bytes.
        GMCH    Graphics and memory controller hub.
        GPU   Graphics processor unit.
        Graphics memory controller hub (GMCH)  A chipset component controlling
        communication between the processor and main memory and containing a built-
        in graphic processor. Also called the Northbridge.
        Graphics processor unit (GPU)  A processor specifically designed to create
        graphics images.
        Grid array package  An integrated circuit package using multiple rows of leads
        on all four sides of the package.
        Gull-wing pin  A package pin that bends outward.
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