Page 279 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim
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MECHANICAL  SENSORS     259

  capacitors  and  the  output voltage  is  related  to  the  deflection of  the  membrane  A*  and
  hence  the  applied  pressure  (P  — P 0).


                           V out  a  AC a  AJC a  (P -  P 0)             (8.33)
  In  this  case, the  accurate  positioning  of  the pickup  electrodes is  crucial.
     By  controlling  the  background  pressure  P 0,  it  is  possible  to  fabricate  the following
  basic  types of pressure  sensors:

   •  An absolute pressure  sensor that is referenced  to a vacuum (P 0 =  0)
   •  A gauge-type pressure sensor  that is referenced to atmospheric  pressure  (P 0  =  1 atm)
  •  A  differential  or relative  type  (P 0  is constant).
  There  are  advantages  and  disadvantages  of  capacitive  against  piezoresistive  pressure
  sensors  and these  are  summarised  in Table  8.10.
     The  main  advantage  of  using  bulk  micromachining  is  that  the  electronic  circuit  can
  be more  readily  integrated.  There  are many examples  of capacitive  pressure  sensors  with
  digital  readout.  Readers are directed  toward Worked Example  6.8 for  the process flow of
  an  air  gap  capacitive  pressure  sensor  with  digital  readout.  An  example  of  a  capacitive
  pressure  sensor  is  shown  in  Figure  8.28  with a  100 urn polysilicon  diaphragm  and  inte-
  grated  capacitance  circuit (Kung and  Lee  1992).  The  output voltage  from  the integrated
  n-type  metal  oxide  semiconductor  (nMOS) circuit  is  also  shown against  air  pressure  in
  non-Si  units of PSI.  This design achieves  a high resolution  by using integrated  electronics.
     An  alternative  approach  to  enhance  the  sensitivity  of  silicon  pressure  sensors  was
  proposed  by  Greenwood  in  1988  and  comprised  the  use  of  a  resonant microstructure.
  Figure  8.29  shows  the  micromechanical  structure  bulk-micromachined  out  of  single-
  crystal  silicon (Greenwood  1988).
     The  basic principle  is  the  change  of resonant frequency of oscillation  of  this structure
  when  the  pressure  on  the  diaphragm  causes  it  to  curve.  In  turn,  this  curvature  creates
  tension  in the  shuttle mass  supports and  this  shifts  its resonant frequency. The dynamical
  equation  that  governs  the  behavior  is  a  modified  version  of  Equation  (8.27)  to include
  a  tension  term,  which  affects  the  effective  spring  constant  k m.  The  resonant  (torsional)

        Table  8.10  Relative  merits  of capacitive  and piezoresistive static  deflection  pres-
        sure  sensors
                         Advantages                 Disadvantages
        Capacitive       More  sensitive  (polysilicon)  Large  piece of  silicon  for
                                                     bulk  micromachining
                         Less  temperature-sensitive  Electronically  more
                                                     complicated
                         More robust               Needs  integrated
                                                     electronics
        Piezoresistive   Smaller  structure than bulk  Strong  temperature-
                           capacitance                dependence
                         Simple  transducer circuit  Piezocoefficient  depends
                                                     on  the  doping  level
                         No  need  for  integration
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