Page 297 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim
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MAGNETIC  SENSORS   277

  In  the  second  device,  the  collectors  are  now  outside  the  base  pads  and  the  Lorentz force
  creates  opposing  Hall fields in the emitter  and base  areas.  Therefore,  the injected emitter
  current  is modulated  differently and  so is the current flowing through the collectors. The
  second  device  has a higher  sensitivity  (7%/T)  than the first device  (0.5  to  5%/T).
     A  bipolar  device  can  also  be  designed  in  which both  processes  occur.  Figure  8.44(a)
  shows a photograph  of such a device  together  with a plot of the difference in the  collector
  current  against  magnetic  flux  density  (Avram et al.  1998). The  plot  shows  that,  when in
  a  common-base  configuration, the collector current difference  of the  magnetotransistor  is
  a  linear  function  of  the  applied  flux  density,  as  predicted  by  Equation  (8.46),  and  has a
  sensitivity  of about 250  uA/T.
     Magnetotransistors,  like  magnetodiodes,  can  also  be  made  from  a  standard  lateral  or
  vertical  CMOS  or  diffusion-channel  MOS  (DMOS)  process,  which has  the  advantage of
  higher  sensitivities.  Interested  readers  are  referred  to  Middelhoek  and  Audet  (1989)  for
  further  details. Despite  the promise  of these latter devices,  the most successful  commercial
  device  is the  Hall effect  IC,  which is  simple  and inexpensive to  process.

  8.5.4  Acoustic Devices  and SQUIDs

  Although a Hall effect  IC  is of practical  use in many situations, there is a general  problem
  of  low  sensitivity.  One  possible  solution,  that  is  rather  attractive,  is  to  use  magnetic
  microsensors  based  on  a  delay-line  SAW device.  Figure  8.45  shows  the  basic structure
  of  a  SAW magnetic  sensor  (Hanna  1987).


     Worked  Example  E8.1:  Magnetostrictive Strain Gauge

     A thin film IDT magnetostrictive strain gauge can be fabricated  using acoustic materials
                                                      17
     and  a wet  metal  etch-based  on  the  propagation  of Love waves .
     Process Flow:

     1.  The  substrate consists  of  a  single-crystal nonmagnetic  (111) gadolinium gallium
       garnet wafer on top of which a thin epitaxial layer of garnet film (Y 1.5Lu 0.3Sm 0.3Ca 0.9
       Ge 0.9Fe 4.1O 12)  is grown.
     2.  This  step  is  followed by  the  thermal evaporation  of  a  layer  of  aluminum  of about
       100 nm thick.
     3.  A thin layer of ZnO is then sputtered down to improve the electromechanical coupling
       of  the Love waves to  the  magnetic garnet film.
                                                               18
     4.  Finally, an IDT metallisation layer is deposited by thermal evaporation  and the elec-
       trode structure is patterned using UV photolithography  and a wet etch. The distance
       between  the  IDT  transducers  is  set  to be  6000  um.


  The  propagation  of  the  SAW  is  modified  by  the  magnetoelastic  coupling  between  the
  magnetic  spin  and  the  strain  fields.  In  other  words,  the  SAW device  is  operating  simply
  as  a  strain sensor  in  which  the  strain  is  induced in  the  garnet  film  by  magnetostriction.

  17
    Love waves, and other surface  acoustic waves, are explained in Chapter 10.
  18
     An  alternate  lift-off  process  is described in Chapter 12.
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