Page 423 - Book Hosokawa Nanoparticle Technology Handbook
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7.2 NANOPARTICLES AND ENVIRONMENT                                            FUNDAMENTALS
                    7.2.6.1 General industrial processes         particles has a distinct bimodality, one with the finer
                  The sources of emission of unwanted nanoparticles  peak at around 10 nm and the coarser one at around
                  in general workplaces are categorized as fumes  1  m.  The former results from within the grinder
                  from hot processes (e.g., smelting, refining, and  motor and the volatilization or combustion of
                  welding) and from (incomplete) combustion      amenable ground substrate and/or grinding materials,
                  processes. Favorable conditions required for the  the latter from the mechanical abrasion and attrition.
                  generation of nanoparticles are found in workplaces  However, the resultant total concentration on the
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                  where there is (1) presence of vaporizable material,  order of 10 particles/cm is not so high.
                  (2) sufficiently high temperature to produce enough
                  vapor, followed by condensation to form an inde-  7.2.6.2 Industrial processes with cleanrooms
                  pendent aerosol, and (3) rapid cooling and a large  Cleanrooms and associated controlled environments
                  temperature gradient.                          (e.g., in the case of an ISO Class 3 cleanroom, the
                    There have been so many studies on occupational  maximum permissible airborne particle concentration
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                  exposure to fine particles in the field of public health.  is less than 10 particles/m for particles with the size
                  In general, high spikes of nanoparticle concentration  of 0.1  m or larger, while the airborne particle con-
                  are observed during active operations, followed by a  centration in ordinary indoor environments is on the
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                  gradual decay after the operation, primarily because  order of 10 particles/m or higher) are usually
                  of coagulation, evaporation, dilution, and/or deposi-  adopted to avoid particle contamination in industrial
                  tion. The fraction of the total number of nanoparticles  processes where precision products such as engi-
                  generally decreases, whereas that of the number of  neered nanoparticles, semiconductors, and other elec-
                  submicrometer particles increases with time and dis-  tronic or optical devices are fabricated because the
                  tance from the point of emission. In order to accu-  deposition of particles onto product surfaces causes
                  rately estimate exposure, the effects of spatial and  their yield reduction and quality deterioration.  The
                  temporal changes will need to be evaluated.    emission sources in cleanroom environments are tab-
                  Therefore, it is important to identify the time required  ulated in Table 7.2.2. Since some of the listed emis-
                  for the concentration to decline to the normal or  sion sources emit trace amounts of nanoparticles,
                  background levels.                             these nanoparticles are not regarded as particulate
                    As an example of reports on grinding processes,  contaminant but as chemical or molecular one. In this
                  Fig. 7.2.11 shows the case where a steel substrate was  section, these nanometer-sized solid substances
                  ground upon using a high-speed grinder [1]. From the  formed on solid surfaces by chemical reaction are
                  figure the distribution of concentration of generated  also included.
































                  Figure 7.2.11
                  Size distribution of nanoparticles generated when a steel plate was ground with a high-speed grinder.

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