Page 426 - Book Hosokawa Nanoparticle Technology Handbook
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FUNDAMENTALS                                 CH. 7 ENVIRONMENTAL AND SAFETY ISSUES WITH NANOPARTICLES
                                                                 mechanical agitation. However, they reported that the
                                                                 concentrations were very low. In addition,
                                                                 measurements of nanoparticle levels during final
                                                                 packaging of carbon black, which is a typical engi-
                                                                 neered nanoparticle material, showed that there was
                                                                 no increase in nearby air [11].

                  Figure 7.2.14
                  Mechanism of watermark formation on a silicon wafer            References
                  surface.
                                                                 [1] A.T. Zimmer, A.D. Maynard: Ann. Occup. Hyg., 46,
                                                                     663 (2002).
                                                                 [2] Y. Otani, N. Namiki: Annu. Res. Rep. Smoking Res.
                  surface is detected in the form of nanometer-sized  Found., 747 (2005) (in Japanese).
                  particles by an electron microscope [8].       [3] M. Suzuki, Y. Yamaji, J. Jpn. Air Cleaning Assoc., 32,
                                                                     218 (1989) (in Japanese).
                  (6) Leakage from nanoparticle production processes  [4] N. Namiki, Y. Otani, H. Emi and S. Fujii:  J. Inst.
                  In regard to the risks to processing equipments by  Environ. Sci., 39, 26 (1996).
                  nanoparticle leakage from production processes, the  [5] K. Kato, A. Tanaka, A. Saiki and J. Hirata: Proc. Air
                  VDI report in Germany [9] has been described in    Cleaning Contam. Control, 5 (1995) (in Japanese).
                  detail. The production of engineered nanoparticles  [6] Y. Ushio,  T. Nakamura, S. Shimizu,  T. Oshino,
                  can be generally categorized into two approaches.
                  One is a “top-down” approach that is initiated with  K. Matsuda and T. Arai: Proc. Air Cleaning Contam.
                  a bulk material and then breaks it into finer pieces  Control, 335 (1998) (in Japanese).
                  using some form of energy such as etching, ball  [7] A. Saiki, S. Ro and  T. Fujimoto:  Chemical
                  milling, sputtering, and laser ablation.  The other  Contamination in Semiconductor Processing
                  approach is to synthesize materials from the atomic  Environments and its Countermeasures, Realize, Inc.,
                  or molecular level by growth and assembly to form  Tokyo, 426 (1997) (in Japanese).
                  the desired nanoparticles. Processes included in this  [8] The Japan Society of Industrial Machinery
                  “bottom-up” category are sol-gel, chemical vapor   Manufactures: Report on Behavior Control of
                  deposition, flame synthesis laser pyrolysis, and   Individual Sort of Contaminants –  1993 Report on
                  so on.                                             Introduction  of  Advanced  Technologies  to
                    Most of these processes are performed in a closed
                  reaction chamber installed in a cleanroom or associ-  Environmental Equipment Industry, 171 (1994) (in
                  ated controlled environment. Human exposure to     Japanese).
                  these engineered particles does not take place during  [9] W. Luther: Industrial Application of Nanomaterials –
                  synthesis unless there is an unexpected system failure  Chance and Risks. Future Technologies, Division of
                  (e.g. rupture of a seal). Human exposure is more   VDI  Technologiezentrum, Düsseldorf, Germany,
                  likely to occur after the manufacturing when opening  p. 112 (2004).
                  the reaction chamber, drying the products, or in the  [10] A.D. Maynard, P.A. Baron, M. Foley, A.A. Shvedova,
                  post-process handling of the products.             E.R. Kisin and  V. Castranova:  J. Toxicol. Environ.
                    The release of nanoparticles during production   Health A, 67, 87 (2004).
                  chamber cleaning operations is another critical  [11] T.A.J. Kuhlbusch, S. Neumann and H. Fissan:
                  point. Cleaning typically involves using water or
                  some solvent. Brushes, sponges, or tissues used in  J. Occup. Environ. Hyg., 1, 660 (2004).
                  the cleaning will carry nanoparticles into the waste
                  stream. Disposal of the waste and wastewater may
                  become a source of nanoparticle release into the  7.3 Safety of nanoparticles
                  environment.
                    Further, conditioning of nanoparticles such as com-
                  pression, coating, and composition to form final  7.3.1 Problems caused by nanoparticles
                  products may also result in the release to the environ-
                  ment and resultant exposure although very few stud-  Study on the safety of nanoparticles has started only
                  ies have been carried out on this subject. Recent  recently, and no sufficiently systemized results have
                  studies [10] to evaluate the aerosol discharge during  been obtained. What should be noted in particular is
                  the handling of carbon nanotubes showed that the  that the possibility of radial troubles caused by partic-
                  generation of nanoparticles occurred under vacuum to  ulate matters are considered to increase by the
                  remove spilled nanotube materials or vigorous  decrease of particle diameter in nanoparticles.

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