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272    Chapter  Seven

                   There are three main process chains that lead to a DFB resonator
               grating substrate. Each process chain includes structuring of a master
               substrate. In the first process chain (1) this master is directly used as
               laser substrate. However, the fabrication of a master substrate is
               expensive and time-consuming, thus this method is only used for
               prototyping. A second process chain (2) uses the replication of the
               master substrate. Different methods allow the multiple replication
               with the master substrate used as a molding tool. However, the mas-
               ter itself may be damaged during the process. This is avoided by
               introducing the fabrication of a replication tool (3) which can be opti-
               mized for long durability. Thus, the latter process chain is suited best
               for commercial applications.
                   The master substrate can be fabricated by serial or parallel pro-
               cesses. Serial processes such as electron beam lithography or direct
               laser writing allow for highest freedom in design of the structures. In
               comparison, parallel processes such as laser interference lithography
               or ablation are fast and applicable to large areas. In the following we
               will describe the most important fabrication methods for the master.

               7.3.1  Master Fabrication: Electron Beam Lithography
               Electron beam lithography (EBL) is a commonly used procedure for
               the fabrication of structures in the nanometer scale. It allows the pro-
               duction of structures with lateral dimensions of less than 20 nm. The
               different processes to fabricate DFB gratings by EBL are schematically
               illustrated in Fig. 7.6. In process  A, a poly(methylmethacrylate)
               (PMMA) resist is spun onto the silica layer of a thermally oxidized sili-
               con wafer, and the solvent content of the polymer layer is reduced by a
               prebake step. Then the resist is exposed to the electron beam, reducing
               the molecular weight of the PMMA in the exposed areas, thus making it
               soluble by a developer in the subsequent process step. After deposition



                    Resist    Patterning &   Chromium
                                                       Liftoff   Dry etch
                   preparation  development  deposition
                A

                B


                C

                D

                    Silicon    Silica   PMMA resist  Chromium    HSQ resist
               FIGURE 7.6  Electron beam lithography fabrication of DFB resonator gratings.
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