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170 Power semiconductor devices and converter hardware issues
Another kind of heat pipe may include insulation between the evaporator and the
condenser allowing water as a coolant or water and glycol and not necessarily
chlorofluorocarbons (CFCs).
Figure 5.13 shows some heat sinks with power semiconductors mounted on them
to illustrate the previously discussed points.
Fig. 5.13 Heat sinks: (a) air cooled extruded heat sink (velocity = 5m/s, Rsa = 0.2 C/W, weight = 2.6 lb/ft); (b) air
cooled fabricated heat sink (velocity = 5m/s, Rsa = 0.02 C/W, weight = 21 lb/ft); and (c) liquid cooled heat sink
(flow rate= 5lt/s, Rsa = 0.002 C/W, weight= 4.5 lb/ft). (Courtesy of R-Theta, Inc., Mississauga, Ontario, Canada.)
