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Advanced Sensors in Pr ecision Manufacturing
                          dioxide laser emission and atmospheric physics. These sensors tend   293
                          to be more expensive than both silicon photodiodes and CdS photo-
                          conductors.

                          6.7.1 Integrated Circuits
                          Incorporating additional electronics directly onto a semiconductor
                          sensor chip makes it possible to add additional functions to the sen-
                          sor. An optical IC is an integrated circuit comprising photodiode and
                          electronic-signal-processing-circuits. Such additional functions as
                          current-to-voltage conversion and reference-level sensing (a Schmitt
                          trigger, for example) can be incorporated. Other optical ICs can pro-
                          vide signals highly immune to noise, such as a current-to-frequency
                          conversion.
                             The principal advantages of an optical IC are ease of use, small
                          size, and immunity to electronic noise compared to a photodiode
                          with separate electronics. Typically, these devices are much more
                          expensive and offer a very limited active light-sensing area. Custom
                          tooling for specific applications is also expensive.

                          6.7.2 Hybrids
                          The electronic functions of an optical IC can also be provided by a
                          hybrid circuit that has an unpackaged IC components “die” attached
                          to a substrate that also contains a photodiode.
                             This type of sensor combines the ease of use and immunity to
                          electrical noise of an optical IC with increased design flexibility and
                          lower tooling costs. In addition, the sensitivity can easily be increased
                          with a larger photodiode active area without the added cost of a sep-
                          arate detector. The primary disadvantages of a hybrid sensor are its
                          cost and reliability. Cost can be several times higher than the electronic-
                          assembly option discussed next, and reliability testing is difficult to
                          amortize, so either limited reliability screening is implemented, or
                          the cost per unit becomes high.


                     6.8 Sensor Electronic Assemblies
                          Combining any of the sensors listed earlier with printed-circuit-based
                          electronic signal processing creates sensor assemblies or black boxes.
                          The user defines specifications for light input and the desired output
                          response; the vendor builds and tests the systems to ensure that the
                          specifications are met. An assembly can also include optical compo-
                          nents such as lenses and special wavelength filters. The user just bolts
                          the assembly in place and connects it to the high-level electronics;
                          there are no concerns about mismatch between the purchased sensor
                          and front-end amplifiers or diagnostic electronics. The system is rela-
                          tively immune from noise and is highly reliable because of the mature
                          manufacturing technologies used.
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