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                                          Gate
                                          electrode
                                                                        Phase 3
                                                                        Phase 2
                                                                        Phase 1
                                                                          Insulating layer
                                         Potential
                                            well                        P-type silicon substrate





                                         1/3 cycle

                       FIGURE 19.107  The movement of charge from one potential well to the next in a 3-phase CCD is illustrated. Each
                       CCD cell has three gate electrodes. In the upper potential diagram, the well is formed under the first electrode in
                       each CCD cell by voltage applied to the phase 1 line. As the voltage is reduced on the phase 1 line and increased on
                       the phase 2 line, the original potential wells collapse and new ones form under the second gate in each cell, causing
                       any charge present in the wells to move sideways as indicated. Two more cycles are required to complete the movement
                       of charge into the first well of the next CCD cell.

                       localized potential well within the cell. A cell of size 8 µm × 8 µm can hold about 200,000 electrons
                       before saturating. Cells designed to be light sensitive have electrodes made of semitransparent polysilicon
                       so that light can penetrate into the storage region, while cells intended only for charge transport are
                       covered with a surface layer opaque to light. During operation, the voltages on the electrodes are held
                       constant for a time (integration time) to allow packets of charge to accumulate on the photosites in
                       proportion to the local irradiance. At the end of this time a sequence of voltage pulses are applied to the
                       electrodes to transfer the packets of charge from one storage cell to the next until they reach a sensing
                       amplifier, which generates a voltage which is about 0.6 µV per electron. The charge transfer efficiency
                       (CTE) of real devices is less than 100% and between 99.95% and 99.999% of the stored charge is moved
                       to the next cell, depending on the precise construction and clocking frequency. This allows devices to be
                       manufactured with a line of many hundreds or thousands of storage cells feeding a single amplifier.
                         Although there are many variations in CCD construction, the basic characteristics of CCDs from
                       different manufactures are similar. CCD light sensors have an inherently linear variation of output voltage
                       with irradiance, from the minimum useful level set by noise to the maximum useful level set by saturation
                       of the output amplifier or by the limited capacity of the charge storage cells. The dynamic range of the
                       device is defined as the ratio of the maximum output signal to the output resulting from noise. Manu-
                       facturers sometimes quote noise figures as peak-to-peak or as root-mean-square values (typically five
                       times smaller), but the former value is more relevant for imaging applications. Due to manufacturing
                       limitations, the photosites do not have identical sensitivity and dark signal characteristics. For example,
                       photoresponse nonuniformity (PRNU) is easy to measure using uniform sensor illumination and is
                       typically 5–10%. Its effects can be removed, if necessary, by calibration. The basic spectral response of a
                       silicon sensor extends from 200 to 1100 nm, with a maximum sensitivity of about 1 µA of generated
                       charge per microwatt of incident radiation, but this is modified by the electrode structures formed on
                       the surface of the silicon. Longer wavelength photons penetrate more deeply than shorter wavelength
                       photons and the short wavelength response is typically worsened to 450 nm by absorption in the surface
                       layers. Infrared photons may generate electrons some distance from the point of entry into the silicon,
                       with the result that the charge may be collected by a different cell. This reduces the resolution of the
                       device and if infrared operation is not required, but the illumination contains infrared (for example, from
                       a tungsten lamp), an infrared reflecting filter (a hot-mirror filter) is often used. If the widest possible
                       spectral response is required, devices have the substrate thinned and are operated with the illumination
                       falling on the back surface, which is free of electrodes. Back illuminated devices are fragile and costly but
                       are used in specialist low-light applications like astronomy and biology.



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