Page 51 - Welding Robots Technology, System Issues, and Applications
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Welding Robots
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                                                   GTAW torch
                                      Electrode gas
                                   Annular gas



                                                                            GTAW power
                                                                              source









                                   Figure 2.8. Schematic representation of dual-shielding GTAW system

                           Very high  currents (I  !  300 A) may also be  used in a  conventional automated
                           GTAW process to increase the penetration depth, but defects  may form and the
                           process becomes  unstable above 500 A. The keyhole  mode gas tungsten arc
                           welding process, which was developed a few years ago, seems to be suitable for
                           ferrous and non-ferrous materials in the range from 3 to 12 mm [13]. However, this
                           keyhole technique is extremely sensitive to arc voltage, and loss of material may
                           occur through the keyhole vent.




                           2.2 Gas Metal Arc Welding (GMAW)

                           In the gas-metal arc welding (GMAW) process n electric arc is established between
                           a consumable electrode, fed  continuously to the  weld  pool, and the  work-piece.
                           Initially the weld pool was shielded by an inert gas, giving the process the popular
                           designation of  metal inert gas (MIG). Nowadays active gases such as carbon
                           dioxide or mixtures of inert and active gases are also used and metal-active gas
                           (MAG) is a common process nomenclature in this case. The designation GMAW
                           includes all these cases. A schematic representation  of the process is shown in
                           Figure 2.9.
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