Page 791 - Advanced Organic Chemistry Part B - Reactions & Synthesis
P. 791

Scheme 8.16. (Continued)                                   767

               a. S. Kurosawa, M. Bando, and K. Mori, Eur. J. Org. Chem., 4395 (2001).      SECTION 8.5
               b. J. M. Mörgenthaler and D. Spitzner, Tetrahedron Lett., 45, 1171 (2004).
               c. Y. K. Reddy and J. R. Falck, Org. Lett., 4, 969 (2002).                   Organometallic
               d. J.-G. Boiteau, P. Van de Weghe, and J. Eustache, Org. Lett., 3, 2737 (2001).  Compounds with
               e. A. Furstner, K. Radkowski, C. Wirtz, R. Goddard, C. W. Lehmann, and R. Mynott, J. Am. Chem. Soc., 124,   -Bonding
                 7061 (2002).
               f. I. M. Fellows, D. E. Kaelin, Jr., and S. F. Martin, J. Am. Chem. Soc., 122, 10781 (2000).
               g. Y. Matsuya, T. Kawaguchi, and H. Nemoto, Org. Lett., 5, 2939 (2003).
               h. Z. Yang, Y. He, D. Vourloumis, H. Vallberg, and K. C. Nicolaou, Angew. Chem. Int. Ed. Engl., 36, 166 (1997).


              8.5. Organometallic Compounds with  -Bonding

                  The organometallic reactions discussed in the previous sections in most cases
              involved intermediates carbon-metal with   bonds, although examples of   bonding
              with alkenes and allyl groups were also encountered. The reactions emphasized in
              this section involve compounds in which organic groups are bound to the metal
              through delocalized   systems. Among the classes of organic compounds that can
              serve as   ligands are alkenes, allyl groups, dienes, the cyclopentadienide anion,
              and aromatic compounds. There are many such compounds, and we illustrate only a
              few examples. The bonding of polyenes in   complexes is the result of two major
              contributions. The filled   orbital acts as an electron donor to empty d orbitals of
              the metal ion. There is also a contribution to bonding, called “back bonding,” from a
                                                  ∗
              filled metal orbital interacting with ligand   orbitals. These two types of bonding are
              illustrated in Figure 8.6. These same general bonding concepts apply to all the other
                organometallics. The details of structure and reactivity of the individual compound
              depend on such factors as: (a) the number of electrons that can be accommodated by
              the metal; (b) the oxidation level of the metal; and (c) the electronic character of other
              ligands on the metal.
                  Alkene-metal complexes are usually prepared by a process by which some
              other ligand is dissociated from the metal. Both thermal and photochemical reactions
              are used.

                                                           CH 2
                                                     RCH     Cl  Cl
                                                           Pd  Pd
                          (C 6 H 5 CN) 2 PdCl 2  + 2 RCH  CH 2  Cl  Cl  CHR
                                                              CH 2
                                                                              Ref. 309





                                        C           C
                                        C
                                                    C

                                      Fig. 8.6. Representation of
                                      bonding  in  a  alkene-metal
                                      cation complex.

              309
                 M. S. Kharasch, R. C. Seyler, and F. R. Mayo, J. Am. Chem. Soc., 60, 882 (1938).
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