Page 150 - An Introduction to Microelectromechanical Systems Engineering
P. 150

Summary                                                                       129

                    Silicon nitride
                                             Silicon dioxide



                        Pattern oxide     Etch grooves;
                        and nitride       strip nitride

                             Silicon nitride
                   p+ Si


                        Pattern front side  Etch grooves;   Etch from back side;
                        nitride           pattern back side  stop on p+;
                                          nitride           strip nitride
                          Silicon nitride  p+ Si  Silicon nitride




                        Pattern nitride;  Protect front side;  RIE p+ Si;
                        etch shallow      pattern back side;  strip nitride
                        grooves           etch cavities;
                                          stop on p+.
                  Figure 4.38  Fabrication process for an electrostatically actuated micropump.





            References

                   [1] Yamazoe, N., and Y. Shimizu, “Humidity Sensors: Principles and Applications,” Sensors
                       and Actuators, Vol. 10, No. 3–4, November–December 1986, pp. 379–398.
                   [2] Kovacs, G. T. A., Micromachined Transducers Sourcebook, New York: McGraw-Hill,
                       1998, pp. 614–623.
                   [3] Johnson, W. A., and L. K. Warne, “Electrophysics of Micromechanical Comb Actuators,”
                       Journal of Microelectromechanical Systems, Vol. 4, No. 1, March 1995, pp. 49–59.
                   [4] Timoshenko, S., “Analysis of Bi-Metal Thermostats,” Journal of the Optical Society of
                       America, Vol. 11, 1925, p. 233.
                   [5] Klaassen, E. H., et al., “Silicon Fusion Bonding and Deep Reactive Ion Etching; A New
                       Technology for Microstructures,” Proc. 8th Int. Conf. on Solid-State Sensors and Actua-
                       tors, Stockholm, Sweden, June 25–29, 1995, pp. 556–559.
                   [6] Halliday, D., and R. Resnick, Physics, Part Two, 3rd ed., Extended version, New York:
                       Wiley, 1986, pp. 718–724.
                   [7] U.S. Patents 3,921,916, November 25, 1975, and 3,949,410, April 6, 1976.
                   [8] Peeters, E., and S. Verdonckt-Vandebroek, “Thermal Ink Jet Technology,” Circuits and
                       Devices, Vol. 13, No. 4, July 1997, pp. 19–23.
                   [9] Kneisel, L. L., J. D. Baker, and L. N. Goenka, “Silicon Micromachined CO Cleaning Noz-
                                                                                 2
                       zle and Method,” U.S. Patent 5,545,073, August 13, 1996.
                  [10] Siewell, G. L., W. R. Boucher, and P. H. McClelland, “The ThinkJet Orifice Plate: A Part
                       with Many Functions,” Hewlett-Packard Journal, Vol. 36, No. 5, May 1985, pp. 33–37.
                  [11] Wu, M. C., “Micromachining for Optical and Optoelectronic Systems,” Proceedings of the
                       IEEE, Vol. 85, No. 11, November 1997, pp. 1833–1856.
   145   146   147   148   149   150   151   152   153   154   155