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138                                   MEM Structures and Systems in Photonic Applications

                                    Sacrificial            Hinge      Yoke    Hinge post
                      Metal-3 level  spacer 1  CMP
                                             oxide




                      Silicon substrate with CMOS circuits
                          1. Pattern spacer 1 layer         4. Etch yoke and strip oxide


                                                          Mirror             Mirror mask

                      Oxide hinge mask    Hinge metal                          Spacer 2








                        2. Deposit hinge metal; deposit    5. Deposit spacer 2 and mirror
                           and pattern oxide hinge mask

                                                         Mirror         Mirror post
                               Yoke metal  Oxide mask
                                                                Yoke           Hinge








                          3. Deposit yoke and pattern        6. Pattern mirror and
                            yoke oxide mask                     etch sacrificial spacers
                 Figure 5.4  Fabrication steps of the Texas Instruments’ DMD [2].

                 form the first sacrificial layer (sacrificial spacer 1). A sputter deposition of an alumi-
                 num alloy (98.8% Al, 1% Si, 0.2% Ti) defines the hinge metal layer. The mechanical
                 integrity of the DMD relies on low stresses in the hinge. A thin silicon dioxide mask
                 is then deposited with PECVD and patterned to protect the torsion hinge regions.
                 The aluminum is not etched after this step. Retaining this silicon dioxide mask,
                 another sputtering step deposits a thicker yoke metal layer, also made of a proprie-
                 tary aluminum alloy. A thin layer of silicon dioxide is subsequently deposited and
                 patterned in the shape of the yoke and anchor posts. An etch step removes the
                 exposed aluminum areas down to the organic sacrificial layer. But in the regions
                 where the oxide hinge mask remains, only the thick yoke metal is removed, stopping
                 on the silicon dioxide mask and leaving intact the thin torsional hinges. Both silicon
                 dioxide masking layers are stripped before a second sacrificial layer, also made of
                 UV-hardened photoresist, is deposited and patterned. Yet another aluminum alloy
                 sputter deposition defines the mirror material and the mirror post. A silicon dioxide
                 mask protects the mirror regions during etch of the aluminum alloy.
                    The remaining fabrication steps address the preparation for sawing and packag-
                 ing, made difficult by the delicate micromechanical structures. A wafer saw cuts the
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