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492                                                    Carraher’s Polymer Chemistry


                                   4°C





                                      20°C

                                Stress    40°C






                                                                  50°C

                                                                               60°C

                                                        Strain


                 FIGURE 14.9  Influence of temperature on the stress–strain behavior of a sample of PMMA. (Modeled
                 after Carswell, T. S., Nason, H. K. (1944): Effects of Environmental Conditions on the Mechanical Properties
                 of Organic Plastics, Symposium on Plastics, American Society for Testing Materials, Philadelphia, PA;
                 Copyright, ASTM, 1916 Race Street, Philadelphia, PA, 19103; Used by permission.)


                    Polymeric materials are dissimilar to metals in a number of respects. For instance, the range of
                 strain–strain behavior is more complex and varied for polymers. Highly elastic polymers can exhibit
                 a modulus as low as 7 MPa or as high as 100 GPa for stiff polymeric materials. The modulus values
                 for metals are higher (50–400 GPa) but not as varied. Tensile strengths for polymers are on the order
                 of 100 MPa for polymers and for some metal alloys 4,000 MPa. By comparison, polymers are more
                 deformable with elastic polymers having elongations in excess of 500% while even “moldable” met-
                 als having elongations not exceeding 100%. Further, stress–strain behavior for polymers is more
                 temperature dependant in comparison to metals. For instance, Figure 14.9 contains the stress–strain
                 behavior for a poly(methyl methacrylate) (PMMA), material. Below the T  the material behaves
                                                                              g
                 as a stiff, brittle solid similar to the behavior given for hard and brittle polymers (Figure 14.9). As
                 the temperature increases, the PMMA gains enough thermal energy to allow for some segmental
                 mobility. The T  varies greatly for PMMA depending upon the tacticity with isotactic PMMA hav-
                              g
                                  o
                                                                     o
                 ing a T  of about 45 C and for syndiotactic the T  is about 130 C. The material in Figure 14.9 is
                       g
                                                          g
                                                             o
                                                     o
                                                o
                 largely isotactic with a T  of about 50 C–60 C. By 50 C, the material behaves as a soft and tough
                                     g
                 material in Figure 14.9.
                 14.3   STRESS–STRAIN RELATIONSHIPS
                 Mechanical testing involves a complex of measurements, including creep and shear strength, impact
                 strengths, and so forth. Stress–strain testing is typically carried out using holders where one mem-
                 ber is movable contained within a load frame. Studies typically vary with either the stress or strain
                 fixed and the result response measured. In a variable stress experiment, a sample of given geometry

                 is connected to the grips. Stress, load, is applied, generally by movement of the grip heads either
                 toward one another (compression) or away from one another (elongation). This causes deformation,
                 strain, of the sample. The deformation is recorded as the force per unit area necessary to achieve
                 this deformation. The applied load versus deformation is recorded and translated into stress–strain
                 curves such as those given in Figures 14.3, 14.8, and 14.10.







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         K10478.indb   492                                                                    9/14/2010   3:42:36 PM
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