Page 171 - Electrical Properties of Materials
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Preparation of pure and controlled-impurity single-crystal semiconductors               153

                     (a)              Heating coil
                                                          Furnace wall



                     Travel





                          B  t a o                     M     o z   n e t l o  e n


                   Temperature
                                                       Melting point
                                                                             Fig. 8.23
                                                                             Zone refining. The molten zone
                                                                             moving through the crystal sweeps
                     (b)                           Distance                  the impurities to the far end.


            melt a slice of it, and arrange for the molten zone to travel along the crystal
            length. This can be done by putting it in a refractory boat and dragging it slowly
            through a furnace, as shown in Fig. 8.23. At any point, the solid separating out
            at the back of the zone will be k times as impure as the melted material which,
            as k < 1, is an improvement. By a fairly simple piece of algebra it can be
            shown that the impurity concentration in the solid, C s (x), after the zone has
            passed down the crystal (of length l ) once is
                                                                             Since k is typically 0.1, it is pos-
                                                                             sible to drive most of the impurity
                             C s (x)= C 0 {1 –(1– k)exp(–kx/z)},      (8.66)
                                                                             to a small volume at the far end
                                                                             with relatively few passes.
            where C 0 is the initial concentration and z is the length of the molten zone.
            Clearly, at the end of the crystal that is melted first, the value of impurity
            concentration will be

                                              n
                                      C s (0) = k C 0                 (8.67)
                                                                                               Rotating
            if this process is repeated n times.                                               chuck
               This very simple idea is the basis of the great success of semiconductor en-
                                                                                               Floating zone
            gineering. As we have said before impurities can be reduced to a few parts in
              10
            10 , and then they are usually limited by impurities picked up from reactions
            with the boat. This latter problem showed up rather strongly when the semicon-  Heating coil
            ductor industry went over from germanium (melting point 937 C) to silicon
                                                                ◦
            (melting point 1958 C). The solution was the floating zone method, which dis-
                            ◦
                                                                                             Silica envelope
            pensed with the boat altogether. In this method the crystal is held vertically in  containing inert
            a rotating chuck (Fig. 8.24). It is surrounded at a reasonable distance by a cool  atmosphere
            silica envelope, so that it can be kept in an inert atmosphere, then outside this  Crystal
            is a single-turn coil of water-cooled copper tubing. A large high-frequency cur-
            rent (several MHz) is passed through the coil, and the silicon crystal is heated  Fig. 8.24
            to melting point by the eddy currents induced in it. The coil is slowly moved up  Floating zone refining.
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