Page 35 - Handbook of Adhesion Promoters
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28                                                  Mechanisms of Adhesion
























            Figure 2.29. Adhesion mechanism of silver nanoparticles on substrate with 3-glycidoxypropyltrimethoxysilane at
            the interface of the film. [Adapted, by permission, from Hong, JU; Kumar, ABVK; Han, HS; Koo, YH;
            Kim, HW; Park, JH; Kang, HS; Lee, BC; Piao, L; Kim, S-H, Bull. Korean, Chem. Soc., 34, 8, 2539-42, 2013.]

            Figure 2.28 shows the structure of painted TPO and its microscopic image. Adhesion pro-
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            moter diffuses 1 μm deep into TPO.
                In polymer blends, adhesion is frequently a problem which causes reduction of their
            mechanical properties. Application of compatibilizers is one of classical examples of how
            to  increase  adhesion  between  polymer  components  by  the  formation  of  interphase
            between them. The properties of interphase permit reaction or interaction of each compo-
            nent  polymer  with  functional  groups  on  the  surface  of  the  compatibilizer  (interphase).
            This can also be achieved by the addition of inorganic materials (e.g., silica) to polymer
            blends. The surface groups on silica can react (or interact) with component polymers to
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            increase interfacial adhesion and toughen the blend.
            2.9 CHEMICAL BONDING

            The mechanisms of adhesion by the participation of chemical bonding are the oldest and
            the most frequently proposed because chemical bonding forms reliable, easy to explain
            connections between substrate and adherent. The covalent bonds have high energy (e.g.,
            C−C − 347, C−O − 358, C−N − 305, C−S − 259, N−O − 201, and O−O − 146 kJ/mol) and
            they require substantial energy to break them. The adhesion promoters are widely avail-
            able and common in use (properties of different groups of adhesion promoters are dis-
            cussed  in  Chapter  7).  Below  we  will  discuss  examples  of  silanes,  maleic  anhydride,
            isocyanates,  sulfur  linkages,  coordination  linkages,  and  functionalized  graphene  com-
            pounds as the most typical adhesion promoters in use.
                Solar cells, memory devices and other flexible electronic elements are produced by
            printing techniques using solution-based materials, as well as suspensions of metals (espe-
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            cially in nano-form), polymers, and carbon nanotubes.  One of the major issues of these
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            processes is poor adhesion to substrates.  For silver nano-ink used for printing on glass
            and  poly(ethylene  terephthalate),  3-glycidoxypropyltrimethoxysilane was used as an
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            adhesion promoter.  Figure 2.29 shows chemical mechanism of action of adhesion pro-
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