Page 148 - High Power Laser Handbook
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118    Diode Lasers


                         5.35%
                   1.0%
                   0.9%

                   0.8%
                   0.7%
                  Failure percent  0.6%
                   0.5%

                   0.4%
                   0.3%

                   0.2%         0.18%
                                       0.13%
                                              0.09%
                   0.1%                              0.08%  0.07%  0.08%  0.08%
                   0.0%
                          0–20  20–40  40–60  60–80  80–100  100–120  120–140  140–160
                                              Time interval (hr)
                 Figure 5.18  Failure distribution of a production burn-in test of 980-nm pump
                 lasers.

                         Laser diode failure rate is an important parameter that must be
                      estimated in order to predict performance in the field. An accelerated
                      multi–cell life test is usually conducted, because running a lengthy
                      test under actual operating conditions would be impractical. 38–40  Cell
                      conditions are typically set at elevated temperature, current, and out-
                      put power to accelerate the failure rate. Comparison (i.e., regression)
                      of the failure rate across different cell conditions allows one to derive
                      a  failure  acceleration  model  under  various  operating  conditions.
                      Table 5.2 summarizes the conditions and results of a 980-nm pump
                      laser multi–cell life test conducted at JDS Uniphase. It is the same
                      laser for which the burn-in failure distribution is shown in Fig. 5.18.
                      All lasers were burned in to screen out infant failures.
                         This test was dominated by failures randomly distributed over
                      time. No wear-out failures were observed at these conditions. The
                      results in Table 5.2 clearly show a significant increase in failures at
                      higher junction temperatures (estimated temperature of the p-n junc-
                      tion that takes into account thermal resistance between the junction
                      and heat sink) and at higher currents. Dependence of failure rate λ on
                      junction temperature T , current I, and power P is usually described
                                          j
                      as follows:
                                                   E  
                                                          n
                                                        m
                                          λ  λ =  exp  −  a   IP          (5.6)
                                            0      kT  
                                                   Bj 
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