Page 60 - High Power Laser Handbook
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32    G a s , C h e m i c a l , a n d F r e e - E l e c t r o n L a s e r s                                                           Excimer Lasers     33


                                       Master oscillator    OC
                         Line        Electrodes                         M1
                       narrowing              Laser gas
                        module

                                          Laser window

                                        Power amplifier
                            RP                                    BS



                                                                        M2
                      Figure 2.13  Typical dual-stage 193-nm laser for microlithography using a
                      ring architecture. OC: output coupler; M1, M2: mirrors; BS: beam splitter;
                      RP: retarder prism.


                      combined with a blazed grating in Littrow condition. The low output
                      of this oscillator is then amplified in the second chamber to reach
                      output powers of 90 W at a repetition rate of 6 kHz. The specific com-
                      bination of the two chambers can be a straight master oscillator power
                      amplifier (MOPA) configuration or it can use a ring geometry in the
                      amplifier stage (see Fig. 2.13).
                         The master oscillator emits a low-power beam with a narrow line
                      width, as determined by the line-narrowing module. The oscillator’s
                      output is then directed toward the amplifier by mirror M2 and gets
                      amplified. The retarder prism (RP) deflects the beam, which then gets
                      amplified to the full output. The beam splitter redirects a small por-
                      tion of the output beam into the amplifier for a second and third loop
                      of amplification. 6,7

                      2.3.3  LASIK
                      LASIK (laser-assisted in situ keratomileusis) is the dominant photo-
                      refractive procedure employed worldwide to correct vision by direct
                      ablation  of  corneal  tissue.  In  1983,  Trokel  and  Srinivasan  of  IBM
                      started their pioneering work on photorefractive surgery using the
                                        8
                      193-nm excimer laser.  Ever since, this application has driven excimer
                      laser development to provide extremely compact lasers that (1) are
                      optimized for ArF operation at 193 nm, (2) meet all stringent require-
                      ments  of  the  medical  device  regulations,  and  (3)  provide  long,
                      maintenance-free operation and simplicity as demanded by medical
                      applications. At the early stage of photorefractive eye surgery, larger
                      lasers with higher energy were used. Today’s trend, however, is to
                      use small energies in the range of 3 to 5 mJ/pulse and repetition rates
                      between 200 and 1000 Hz; these ranges, in combination with high-
                      speed precision scanners, provide a short treatment time. A typical
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