Page 62 - High Power Laser Handbook
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34    G a s , C h e m i c a l , a n d F r e e - E l e c t r o n L a s e r s                                                           Excimer Lasers     35


                         The optical resolution that is achievable in laser material process-
                      ing is proportional to the laser’s wavelength. The short wavelengths
                      of excimer lasers enable them to be among the most precise optical
                      processing  tools  on  the  market.  Depending  on  laser  wavelength,
                      material, and optical system, excimer laser–based material process-
                      ing tools achieve feature sizes of 1 mm and smaller. The advantage of
                      micromachining with a short UV wavelength is shown in the follow-
                      ing equation for minimum feature size (MFS):
                                                     λ
                                           MFS ≈  1  ∗ k  NA


                      where k  is processing factor, λ is wavelength, and NA is numerical
                             1
                      aperture. With a practical numerical aperture of 0.12 and a process
                      factor of 0.5, the 248-nm excimer laser yields a resolution of 1 mm.
                         Moreover, whereas the short wavelength translates into smaller
                      lateral  structures,  it  is  the  strong  material  absorption  of  the  corre-
                      spondingly high photon energy (e.g., 5.0 eV for 248 nm or 6.4 eV for
                      193 nm) that translates into very limited vertical material impact. In
                      fact, the depth resolution of excimer laser thin-layer material process-
                      ing is in the submicron range and can be as small as 50 nm/laser
                      pulse depending on the material sample and the wavelength.
                         The short wavelength is directly absorbed by “transparent” mate-
                      rials, such as glass, quartz, Teflon, or transmissive conductor oxide
                      (TCO) films, allowing UV laser radiation to directly interact with the
                      small  defined  absorption  volume  and  to  minimize  bulk  heating
                      effects. This advantage has led to a set of successful applications in
                      which material processing with minimum heat effect is demanded.
                      Figure 2.15 shows an example of the excimer ablation in glass. The
                      crater’s flatness indicates the high homogeneity of the excimer laser
                      beam over the entire illumination area.



















                      Figure 2.15  Excimer laser ablation pit in NIST (National Institute of
                      Standards and Technology, Gaithersburg Maryland, USA); glass obtained at
                      193 nm after 50 laser pulses.
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