Page 64 - High Power Laser Handbook
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36    G a s , C h e m i c a l , a n d F r e e - E l e c t r o n L a s e r s                                                           Excimer Lasers     37


                      Ink-Jet Nozzle Drilling
                      One  of  the  relevant  industrial  applications  is  the  drilling  of  high-
                      precision  nozzles  for  ink-jet  printers  or  dispensers  of  liquids  and
                      pharmaceuticals. Such nozzle arrays are typically fabricated on poly-
                      imide film with film thickness of about 10 mm. Depending on the spe-
                      cific application, the nozzles vary in size from 50 mm down to 2 mm
                      and  often  demand  a  high  precision  on  roundness,  diameter  on
                      entrance and exit, and tight control of the taper angle. The tolerance of
                      the hole size can be as small as 1 percent, and the variation on the
                      taper angle can be less than 1 degree. The 248 nm laser with energy
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                      density of typically 1000 mJ/cm  has proved to be an excellent laser
                      for  achieving  reproducible  ablation  within  the  tight  tolerances
                      demanded by 24-hour, 7-days-a-week industrial manufacturing con-
                      ditions.  Following  the  typical  setup  (Fig.  2.16),  a  complete  nozzle
                      plate, similar to that shown in Fig. 2.17, with as much as 300 nozzles
                      is fabricated simultaneously. With an output power of 100 W, a high
                      productivity is reached.

                      Three-Dimensional Patterning
                      To achieve dense, repeating, three-dimensional structures on a large
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                      scale, the synchronous image scan (SIS) should be used.  In this tech-
                      nique, the contour of the desired feature is sliced into multiple layers
                      in the axis of the ablation z. The ablation per pulse is in the range of
                      0.1 to 0.2 mm. In this process, the substrate moves continuously dur-
                      ing  pulsed  laser  triggering,  so  that  coincident  with  each  projected
                      laser pulse, the substrate moves by exactly one image repeat pitch.
                      Changing the mask synchronously with the pulsing of the excimer
                      laser yields the exact ablation pattern for each layer and results in the
                      desired three-dimensional contour on the substrate.






















                      Figure 2.17  Nozzle array and single nozzle with flow channel.
                      (Source: LEXMARK)
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