Page 325 - System on Package_ Miniaturization of the Entire System

Radio Fr equency System-on-Package (RF SOP) 299

Port 3
Layer 0
Port 1
Layer 1
Port 2

Layer 2

Layer 3

Layer 4

(a) (b)
FIGURE 5.37 (a) Photograph and (b) confi guration of the stripline multilayer balun.

0 0

–5
–5
S 11 (dB) –10 S 21 (dB) –10

–15
–15
–20 dbS _meas
dbS _2_meas 21
11
dbS 11 _sim dbS _sim
21
–25 –20
3 4 5 6 7 8 3 4 5 6 7 8
Frequency (GHz) Frequency (GHz)
FIGURE 5.38 Measured and simulated results of the stripline balun designed for 5.8 GHz.
Embedded microstrip ATTEN 10dB MKB –19.83d Bm
line interconnection Port 2 RL 0dbm 10dB/ 14.01GHz

Port 3

Vertical structure without
LPF
START–1000MHz STOP 18 .10GHz ERR 358
Step impedance LPF
RBW 1.0MHz *VB 10kHz SWP 4.60 60sec SPAC CAL
(a) (b)
FIGURE 5.39 (a) Picture of fabricated combiner in MLO process, 5 mm in length. (b) Frequency
spectrum at the output port.