Page 355 - System on Package_ Miniaturization of the Entire System

850 o C or Tg 1550 1300 Comments sublimation n (632 nm) nm nm nm Hard cladding 25 1.3–1.6 0.5 0.2 0.02 to contain the –50 0.07 0.03 0.01 core polymer n at 1550 nm 1.472–1.532 0.23 n at 1300 nm 1.543–1.395 0.52 0.16 ~200 1.48–1.6 4.72 0.5 0.08 1.7 0.07 0.02 n at 1310 nm 400 1.5365 0.43 0.17 n at 1550 nm 1.5345 n at 13

Process UV, RIE laser ablation RIE RIE UV, RIE RIE RIE RIE laser ablation UV UV, RIE laser ablation UV, RIE laser ablation

Material Acrylate Halogenated acrylate Cross-linked silicone from methyl and deuterated (d-phenyl) group Silicone UV epoxy resin Halogenated acrylate Deuterated polysiloxane Halogenated polyimide Benzocyclobutanes (BCB), cyclotene resins Perfluorocyclobutane Acrylate (polyguide) Organically modified ceramics (ORMOCER), Frau

Supplier Allied Signal Dow Corning Telephonics NTT Dow DuPont, Optical CrossLinks Micro Resist Technology, GmbH, Berlin, Germany

Ref. T1, T2 T1 T3 T4 T5, T6 T1 T1, T7 T8, T9, T1, T10 T1, T11 T1, T12 T1 T13, T14 TABLE 6.1

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