Page 357 - System on Package_ Miniaturization of the Entire System
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850 o C or Tg 1550 1300 Comments sublimation n (632 nm) nm nm nm n at 1550 nm 1.575 0.48 0.22 n at 630 nm 300 1.491–1.543 0.4 0.24 0.1 n at 1550 nm 1.474–1.528 400 1.45–1.55 1.4 0.05 200 0.1 200 0.06 n at 850 nm 250 1.510 0.5 0.110 0.015 n at 1300 nm 400 1.4440– 1.9 0.14 1.5823 250–400 1.444–1.4545 0.4 0.
Process RIE, UV UV UV UV UV UV UV RIE UV,
Epoxy novolak resin Inorganic polymer Epoxy siloxane
Material glass (IPG) oligomer EPOXY Siloxane Siloxane Siloxane (TiO 2 doped) Polycyanurate True Mode (acrylate)
Supplier MicroChem RPO Pty. Ltd. Acton, Australia Polyset NTT Dow Corning Shipley / Rohm&Haas Kyocera Corporation Fraunhofer IZM TeraHertz Exxelis (Continued)
TABLE 6.1
Ref. T15 T16, T17 T18 T19 T20 T21 T22 T23 T24
330