Page 356 - System on Package_ Miniaturization of the Entire System

Comments Hard cladding to contain the core polymer n at 1550 nm n at 1300 nm n at 1310 nm n at 1550 nm n at 1300 nm n at 630 nm n at 1300 nm n at 1550 nm n at 1300 nm n at 830 nm

o C or sublimation

Tg 25 –50 ~200 400 335 350 400 250

n (632 nm) 1.3–1.6 1.472–1.532 1.543–1.395 1.48–1.6 1.5365 1.5345 1.51–1.52 1.552–1.561 1.537–1.544 1.535–1.543 1.4878 1.5214– 1.538

1550 nm 0.5 0.07 0.23 0.52 4.72 1.7 0.43 1.0 1.5 0.25 0.6 0.55

1300 nm 0.2 0.03 0.16 0.5 0.07 0.17 0.3 0.8 0.25 0.2 0.23

850 nm 0.02 0.01 0.08 0.02 0.5 0.18 0.06

Process UV, RIE laser ablation RIE RIE UV, RIE RIE RIE RIE laser ablation UV UV, RIE laser ablation UV, RIE laser ablation

Material Acrylate Halogenated acrylate Cross-linked silicone from methyl and deuterated (d-phenyl) group Silicone UV epoxy resin Halogenated acrylate Deuterated polysiloxane Halogenated polyimide Benzocyclobutanes (BCB), cyclotene resins Perfluorocyclobutane Acrylate (polyguide) Organically modified ceramics (ORMOCER), Frau

Supplier Allied Signal Dow Corning Telephonics NTT Dow DuPont, Optical CrossLinks Micro Resist Technology, GmbH, Berlin, Germany

Ref. T1, T2 T1 T3 T4 T5, T6 T1 T1, T7 T8, T9, T1, T10 T1, T11 T1, T12 T1 T13, T14 TABLE 6.1

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