Page 366 - System on Package_ Miniaturization of the Entire System
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338    Cha pte r  S i x


                    compatibility with an ISA bus or a Micro Channel bus. Ordinary PC add-in cards can be
                    placed several meters from a PC, to which they are connected via the optical link [44].
                    The link converts the parallel signals on the PC’s I/O bus into serial format, preserving
                    the coherency of the bus protocol, and then transmits them via an optical fiber. Since the
                    optical communication link is perfectly transparent to add-in cards and software,
                    programs can directly access add-in cards placed at a distance from the PC as if they
                    were installed in the PC box. The maximum distance is 100 m for the ISA bus and 10 m
                    for the Micro Channel bus.
                       Unfortunately the work on card-to-card optical links for enhancing network
                    connectivity and performance stopped at this point. A few years later both NTT and NEC
                    published results of their development work on optically linking printed circuit boards in
                    their mainframes. In this case, either optical fiber arrays or arrays of polymer waveguides
                    are used in conjunction with miniaturized optical transceivers containing arrays of lasers,
                    photodetectors, and associated amplifiers and laser drivers. The transceivers used for
                    card-to-card optical communication are miniaturized versions of bulkier optical
                    transceivers used in the optical communication industry. The substantial decrease in form
                    factor is made possible by running the lasers uncooled. The work from NEC [26,42–43],
                    using optical fibers, is shown in Figure 6.6, while that from Optical CrossLinks [45] and
                    NTT [46–47] using polymer waveguides are shown in Figure 6.7a and b.
                                                                   o
                       In all three cases, the optical interconnects contain 45  beam steering mirrors and, in
                    some cases, microlenses. It is precisely this construction, borrowed from the telecom
                    industry, which makes scaling difficult for interboard optical interconnects even without
                    thermoelectric (TE) coolers and hermetic seals. The problem is largely based on cost.
                    Neither the telecom industry nor the emerging computer optoelectronics industry have
                    been able to find a way to quickly and reliably align optical fibers, lenses, mirrors, and
                    lasers or PDs, except manually or with robotic assistance, in some cases.



                     Optical cross links                           NTT
                                        Figure 5 both boards interconnected  MT-compatible connector
                                       through the MT interface and light coupled
                                                                                 Waveguide film















                                                                      Fiber ribbon  MT connector
                                        (a)                                   (b)

                    FIGURE 6.7  (a) Multichannel fl exible optical interconnect polymer waveguide ribbon from Optical
                    CrossLinks, using MT connectors. (b) Flexible multichannel polymer waveguide ribbon connected
                    to optical fi bers via MT connectors from NTT.
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