Page 365 - System on Package_ Miniaturization of the Entire System
P. 365
Integrated Chip-to-Chip Optoelectr onic SOP 337
FIGURE 6.5 Optical PC bus extension adapter cards and an optical fi ber cable. [44]
IBM was the first company to offer a commercially available optical bus for high-
speed optical communication between two computers over several meters via card-to-
card optoelectronic data transceivers as shown in Figure 6.5. In 1993, the IBM Tokyo
Research Laboratory developed a technology for extending the I/O buses of personal
computers. A PC bus is extended by means of an optical fiber, preserving full
BGA Type OIP Package
BGA substrate Cross sectional view
(35 mm × 35 mm PETIT
standard 352-pin) (8 mm × 8 mm) Heat sink
CMOS
PETIT Fiber-connector
CMOS
chip
BGA substrate Mold (if necessary)
PETIT fiber-connector
All optical and analog chips are assembled on the ceramic substrate.
In-package optics ← Mounting PETIT directly on a BGA substrate.
FIGURE 6.6 Multichannel optical transceiver fi ber ribbon developed at NEC using optical fi bers
and miniaturized MT connectors [26].
