Page 56 - System on Package_ Miniaturization of the Entire System

Intr oduction to the System-on-Package (SOP) Technology 33

implementation by adopting a top-down approach to the system design, application of
self-calibration schemes, modularity approach in RFIC design, and the use of custom
board and front-end (FE) elements to reduce the part count [44].

1.10 SOP Technologies
The SOP concept seeks to integrate multiple system functions into one compact,
lightweight, low-cost, and high-performance package or module system. Such a system
design may call for high-performance digital, RF, optical, and sensor functions as
indicated in Figure 1.33 in the SOP concept.
The technologies involved in the SOP concept have been outlined in the different
chapters of this book:
• Introduction to the System-on-Package (SOP) Technology (Chapter 1)
• System-on-Chip (Chapter 2)
• Stacked ICs and Packages (SIP) (Chapter 3)
• Mixed-Signal (SOP) Design (Chapter 4)
• RF SOP (Chapter 5)
• Optoelectronics SOP (Chapter 6)
• SOP Substrate (Chapter 7)
• Mixed-Signal Reliability (Chapter 8)
• MEMS (Chapter 9)
• Wafer-Level SOP (Chapter 10)
• Thermal SOP (Chapter 11)
• SOP Electrical Test (Chapter 12)
• Biosensor SOP (Chapter 13)

FIGURE 1.33 SOP includes all system building blocks: SOCs, SIPs, MEMS, embedded components
in ICs and substrates, thermal structures, batteries, and system interconnections.