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28 Cha pte r O n e

FIGURE 1.27 Optical transceiver developed by IBM. (Courtesy: IBM)

prototype optical transceiver chipset is capable of reaching speeds at least eight times
faster than traditional discrete optical components available today.

1.8.2 RF SOP
At the Interuniversity Microelectronics Center (IMEC), in Leuven, Belgium, Robert
Mertens and colleagues are studying the best type of RF antenna to build in an SOP for
a range of wireless communications products yet to be introduced. IBM has developed
a small, low-cost chipset that could allow wireless electronic devices to transmit and
receive 10 times faster than today’s advanced WiFi networks. The embedding of the
antennas directly within the package helps reduce the system cost since fewer
components are needed. A prototype chipset module, including the receiver, transmitter,
and two antennas, would occupy the area of a dime. By integrating the chipset and
antennas in commercial IC packages, companies can use existing skills and infrastructure
to build this technology into their commercial products.

FIGURE 1.28 Wireless chipset module developed by IBM. (Courtesy: IBM)