Page 47 - System on Package_ Miniaturization of the Entire System

24 Cha pte r O n e

System Drivers

Higher
Higher system
performance
reliability
Higher volumetric
thermal Lower power
dissipation consumption

Higher Smaller
flexibility size

Faster time Lower manufacturing
(a) to market cost

Higher
Higher system performance
reliability MCM
(multichip
module)
Higher volumetric Lower power
thermal
consumption
dissipation
SIP stacked ICs
and packages

Higher Smaller
flexibility size
SOB system SOP system
on board on package
Faster time Lower
to market manufacturing
cost
SOC system on chip
(b)

FIGURE 1.23 (a) System drivers: miniaturization, electrical performance, power usage, thermal
performance, reliability, development and manufacturing cost, time-to-market, and fl exibility.
(b) System technologies compared against system driver parameters showing the strengths and
weaknesses of each.

power. Low-power circuit implementations for mobile applications require high-Q
passive components. In standard silicon technologies, the Q factor is limited to about 25
due to the inherent losses of silicon [21] and large area usage beyond traditional digital
CMOS dimensions. This can be improved by using esoteric technologies such as thick
oxides, high-resistivity Si, SiGe, or gallium arsenide (GaAs), which increase the cost
substantially. In addition, these passive components consume valuable real estate and
occupy more than 50 percent of the silicon area.