Page 60 - System on Package_ Miniaturization of the Entire System
P. 60
Intr oduction to the System-on-Package (SOP) Technology 37
43. Lesley A. Polka, Rockwell Hsu, Todd B. Myers, Jing H. Chen, Andy Bao, Cheng-
Chieh Hsieh, Emile Davies-Venn, and Eric Palmer, “Technology options for next-
generation high pin count RF packaging,” 2007 Electronic Components and Technology
Conference, pp. 1000–1006.
44. M. Ruberto, R. Sover, J. Myszne, A. Sloutsky, Y. Shemesh, “WLAN system, HW, and
RFIC architecture for the Intel pro/wireless 3945ABG network connection,” Intel
Technology Journal, vol. 10, issue 2, 2006, pp. 147–156.
