Page 57 - System on Package_ Miniaturization of the Entire System

34 Cha pte r O n e

1.11 Summary
SOP is about system miniaturization enabled by IC and system integration by ultrathin-
film components at microscale in the short term and nanoscale in the long term for all
system components. Some of these thin-film system technologies that SOP enables can
be used in CMOS ICs as overlays, as thin films on top of silicon wafers (TFOS) and
silicon carriers, or on ceramic and glass substrates or embedded into multilayer ceramic
or organic laminate packages and boards.
SIP is defined in this book as the stacking of ICs and packages. But since SIP is also
often referred to as a total system technology that miniaturizes and integrates all system
components such as passives, actives, thermal structures, power sources, and I/Os, if this
happens, then SOP and SIP are identical. But so far, this has not been demonstrated.

Acknowledgments
The authors gratefully thank the Georgia Tech PRC team of faculty, engineers, students,
and industry advisors for their contributions in the development of the SOP technology.
The authors also thank both the Georgia Research Alliance and the National Science
Foundation Engineering Research Centers for their funding of SOP technology for more
than a decade.

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