Page 279 - MEMS Mechanical Sensors

268 Index

Strain gauges (continued) future devices, 168
temperature-compensated semiconductor, introduction, 153–54
154 magnetic devices, 162–64
Substrates, 7–11 micro, 156
glasses, 10–11 optical devices, 159–60
quartz, 10 resonant/SAW devices, 157–59
silicon, 7–10 scanning probes, 164–66
types of, 10 SFM, 164
Surface acoustic wave sensors (SAWS) silicon-based devices, 154–57
operation mode use, 91 size, 162
resonators, 142–43, 159 surface acoustic wave (SAW) technology,
technology, 154 154
Surface micromachining, 28–29 tactile, 166–68
drying method, 29 Transducers, 3
structure, 28 mechanical, 3–4
See also Fabrication multiaxial strain, 167
System level modeling, 39 Triple-beam tuning fork (TBTF), 101
Tunneling accelerometers, 186–87
T defined, 186–87
illustrated, 187
Tactile sensors, 166–68
integrated tooth-like, 166 See also Accelerometers
Turbulent, 215, 247–48
silicon micromachined array, 167
Tape automated bonding, 61 Turbulent flows, 215
issues, 247–48
Temperature effects, 119
Thermal expansion coefficients, 78 measuring, 247
Thermal flow sensors, 217–29 See also Flows; Flow sensors
anemometers, 219–25
bidirectional, 226 U
calorimetric, 220–23 Universal Transducer Interface (UTI) chip,
commercial devices, 225–29 138–39
defined, 217
as pressure difference sensors, 218 V
research devices, 219–25 Vacuum bonding, 32
time of flight, 223–25
Vacuum sensors, 123
working principle schematic, 217 Vibration excitation/detection mechanisms,
See also Flow sensors 98–99
Thermal growth, 12–13 VisSim, 43
Thermistors, 218
Thick-film screen printing, 32–33
Through-wafer contacts, 69 W
Time of flight sensors, 223–25 Wafer bonding, 29–32
defined, 223–25 adhesive, 31–32
measurement curve, 225 aligning, 32
nonthermal, 239–41 anodic, 30–31
uses, 225 eutectic, 31
See also Flow sensors; Thermal flow sensors silicon fusion, 29–30
Topography, 20–21 vacuum, 32
Torque sensors, 153–68 See also Fabrication
AFM, 164–66 Wafer level packaging, 67–68
capacitive devices, 160–62 advantages, 67–68