Page 93 - MEMS Mechanical Sensors

82 Mechanical Sensor Packaging

[20] Kimura, S., et al., “Stable and Corrosion Resistant Sapphire Capacitive Pressure Sensor for
High Temperature and Harsh Environments,” Transducers ’01/Eurosensors XV, 11th
International Conference on Solid State Sensors and Actuators, Munich, Germany, June
10–14, 2001, Digest of Technical Papers, Vol. 1, pp. 518–521.
[21] Renard, S., “Wafer Level Surface Mountable Chip Size Packaging for MEMS and ICs,”
Proc. SPIE, Vol. 4176, 2000, pp. 236–241.
[22] Neysmith, J., and D. F. Baldwin, “Modular Device Scale, Direct Chip Attach Packaging for
Microsystems,” IEEE Trans. on Components and Packaging Technologies, Vol. 24, No. 4,
December 2001, pp. 631–634.
[23] Cheng, C. H., et al., “An Efficient Electrical Addressing Method Using Through-Wafer Vias
for Two-Dimensional Ultrasonic Arrays,” Proc. IEEE Ultrasonics Symposium, October
22–25, 2000, San Juan, PR, Vol. 2, pp. 1179–1182.
[24] Chow, E. M., et al., “Process Compatible Polysilicon-Based Electrical Through Wafer Inter-
connects in Silicon Substrates,” IEEE Journal of Microelectromechanical Systems, Vol. 11,
No. 6, December 2002, pp. 631–640.
[25] Nguyen, N. T., et al. “Through-Wafer Copper Electroplating for Three Dimensional Inter-
connects,” J. Micromech. Microeng., Vol. 12, 2002, pp. 395–399.
[26] Petrovic, S., et al., “Low-Cost Water Compatible Piezoresistive Bulk Micromachined Pres-
sure Sensor,” Proc. of the Pacific Rim/ASME International Intersociety Electronic and Pho-
tonic Packaging Conference, June 15–19, 1997, New York, Vol. 1, pp. 455–62.
[27] Dyrbye, K., T. R. Brown, and G. F. Eriksen, “Packaging of Physical Sensors for Aggressive
Media Applications,” J. Micromech. Microeng., Vol. 6, 1996, pp. 187–192.
[28] Eriksen, G. F., and K. Dyrbye, “Protective Coatings in Harsh Environments,” J. Micro-
mech. Microeng., Vol. 6, 1996, pp. 55–57.
[29] Terabe, H., et al., “A Silicon Pressure Sensor with Stainless Steel Diaphragm for High Tem-
perature and Chemical Application,” Transducers ’97, 1997 International Conference on
Solid State Sensors and Actuators, Chicago, IL, June 16–19, 1997, Proceedings, Vol. 2, pp.
1481–1484.
[30] Lee, N. K. S., et al., “A Flexible Encapsulated MEMS Pressure Sensor System for Biomedical
Applications,” Microsystem Technologies, Vol. 7, 2001, pp. 55–62.
[31] Gotz, A., et al., “Manufacturing and Packaging of Sensors for Their Integration in a Vertical
MCM Microsystem for Biomedical Applications,” IEEE Journal of Microelectromechani-
cal Systems, Vol. 10, No. 4, December 2001, pp. 569–579.
[32] Heschel, M., et al., “Stacking Technology for a Space Constrained Microsystem,”
IEEE Workshop on Microelectro Mechanical Systems, MEMS ’98, Heidelberg, Germany,
pp. 312–317.
[33] Kelly, G., et al., “3-D Packaging Methodologies for Microsystems,” IEEE Trans. on
Advanced Packaging, Vol. 23, No. 4, November 2001, pp. 623–630.
[34] Barrett, J., et al., “Performance and Reliability of a Three-Dimensional Plastic Moulded
Vertical Multichip Module,” Proc. 45th IEEE Electronics and Components Conf., May
21–24, 1995 Las Vegas, NV, pp. 656–663.
[35] Murzin, I., et al., “MO CVD Interconnects for Spherical Semiconductors,” Microelectronic
Engineering, Vol. 50, 2000, pp. 515–523.
[36] Germer, W., and G. Kowalski, “Mechanical Decoupling of Monolithic Pressure Sensors in
Small Plastic Encapsulants,” Sensors and Actuators, Vol. A23, 1990, pp. 1065–1069.
[37] Holm, R., et al., “Stability and Common Mode Sensitivity of Piezoresistive Silicon Pressure
Sensors Made by Different Mounting Methods,” Proc. Int. Conf. Solid State Sensors and
Actuators (Transducers ’91), 1991, pp. 978–981.
[38] Matsuoka, Y., et al., “Characteristic Analysis of a Pressure Sensor Using the Silicon Piezore-
sistance Effect for High Pressure Measurement,” J. Micromech. Microeng., Vol. 5, 1995,
pp. 25–31.