Page 94 - MEMS Mechanical Sensors

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[39] Spiering, V. L., S. Bouwstra, and R. M. E. J. Spiering, “On Chip Decoupling Zone for Pack-
age Stress Reduction,” Sensors and Actuators, Vol. A39, 1993, pp. 149–156.
[40] Spiering, V. L., et al., “Membranes Fabricated with a Deep Single Corrugation for Package
Stress Reduction and Residual Stress Relief,” J. Micromech. Microeng., Vol. 3, 1993, pp.
243–246.
[41] Vaganov, V. L., “Construction Problems in Sensors,” Sensors and Actuators, Vol. A28,
1991, pp. 161–172.
[42] Offereins, H. L., et al., “Stress Free Assembly Technique for a Silicon Based Pressure Sen-
sor,” Tech. Digest Microsystems Technologies ’90, Berlin, Germany, September 10–13,
1990, pp. 515–520.
[43] Greenwood, J., and T. Wray, “High Accuracy Pressure Measurement with a Silicon Reso-
nant Sensor,” Sensors and Actuators, Vol. A37–38, 1993, pp. 82–85.
[44] Halg, B., and R. S. Popovic, “How to Liberate Integrated Sensors from Encapsulation
Stress,” Sensors and Actuators, Vol. A21–23, 1990, pp. 908–910.
[45] Birkelund, K., et al., “High Pressure Silicon Sensor with Low Cost Packaging,” Sensors and
Actuators, Vol. A92, 2001, pp. 16–22.
[46] Germer, W., and G. Kowalski, “Mechanical Decoupling of Monolithic Pressure Sensors in
Small Plastic Encapsulations,” Sensors and Actuators, Vol. A21–23, 1990, pp. 1065–1069.
[47] Reichl, H., “Packaging and Interconnection of Sensors,” Sensors and Actuators, Vol.
A25–26, 1991, pp. 63–71.
[48] Maudie, T., and J. Wertz, “Pressure Sensor Performance and Reliability,” IEEE Industry
Applications Magazine, May/June 1997, pp. 37–43.
[49] Lin, Y.-C., P. J. Hesketh, and J. P. Schuster, “Finite-Element Analysis of Thermal Stresses in
a Silicon Pressure Sensor for Various Die-Mount Materials,” Sensors and Actuators, Vol.
A44, 1994, pp. 145–149.
[50] Reynolds, J. K., et al., “Packaging a Piezoresistive Pressure Sensor to Measure Low Abso-
lute Pressures over a Wide Sub Zero Temperature Range,” Sensors and Actuators, Vol.
A83, 2000, pp. 142–149.