Page 92 - MEMS Mechanical Sensors
P. 92

4.5 Conclusions                                                                81

                  packaging process, the thermal compatibility of any the materials involved, and the
                  long-term stability of the assembly.




            References

                   [1] Tammala, R., E. J. Rymaszewski, and A. G. Klopfenstein, Microelectronics Packaging
                       Handbook, New York: Wiley, 1997.
                   [2] Cazenave J. P., and T. R. Suess, “Fodel Photoimageable Materials—A Thick Film Solution
                       for High Density Multichip Modules,” Proc. of the SPIE, Vol. 2105, 1993, pp. 483–488.
                   [3] Harman, G. G., Wire Bonding in Microelectronics: Materials, Processes, Reliability, and
                       Yield, New York: McGraw-Hill, 1997.
                   [4] Liu, J., and Z. Lai, “Reliability of Anisotropically Conductive Adhesive Joints on a Flip-
                       Chip/FR-4 Substrate,” Transactions of the ASME, Journal of Electronic Packaging, Vol.
                       124, No. 3, September 2002, pp. 240-245.
                   [5] Gilleo, K., and P. Ongley, “Pros and Cons of Thermoplastic and Thermoset Polymer Adhe-
                       sives in Microelectronic Assembly Applications,” Microelectronics International, Vol. 16,
                       No. 2, 1999, pp. 34–38.
                   [6] Khanna, P. K., S. K. Bhatnagar, and W. Gust, “Analysis of Packaging and Sealing Tech-
                       niques Microelectronic Modules and Recent Advances,” Microelectronics International,
                       Vol. 16, No. 2, 1999, pp. 8–12.
                   [7] Ko, W. H., “Packaging of Microsensors,” Proc. 4th Int. Conf. on Micro Opto Mechanical
                       Systems and Components, Berlin, Germany, October 19–21, 1994, pp. 477–480.
                   [8] Hsu, T.-R., “Packaging Design of Microsystems and Meso-Scale Devices,” IEEE Trans. on
                       Advanced Packaging, Vol. 23, No. 4, November 2000, pp. 596–601.
                   [9] Kelly, G., et al., “Microsystems Packaging: Lessons from Conventional Low Cost IC Pack-
                       aging,” J. Micromech. Microeng., Vol. 7, 1997, pp. 99–103.
                  [10] Ko, W. H., “Packaging of Microfabricated Devices,” Materials Chemistry and Physics,
                       Vol. 42, No. 3, 1995, pp. 169–175.
                  [11] Sparks, D. R., “Packaging of Microsystems for Harsh Environments,” IEEE Instrumenta-
                       tion and Measurement Magazine, September 2001, pp. 30–33.
                  [12] Maudie, T., and J. Wertz, “Pressure Sensor Performance and Reliability,” IEEE Industry
                       Applications Magazine, May/June 1997, pp. 37–43.
                  [13] Motta, V., et al., “Packaging for a Rotational Accelerometer: Is a Standard Plastic SOIC an
                       Industrial Solution?” Proc. of the SPIE, Vol. 4174, 2000, pp. 377–387.
                  [14] Nysaether, J. B., et al., “Measurement of Package-Induced Stress and Thermal Zero Shift in
                       Transfer Molded Silicon Piezoresistive Pressure Sensors,” J. Micromech. Microeng., Vol. 8,
                       1998, pp. 168–171.
                  [15] Li, G., and A. A. Tseng, “Low Stress Packaging of a Micromachined Accelerometer,” IEEE
                       Trans. on Electronics Packaging Manufacturing, Vol. 24, No. 1, January 2001, pp. 18–24.
                  [16] Chang-Chien, P. P. L., and K. D. Wise, “Wafer Level Packaging Using Localized Mass
                       Deposition,” Transducers ’01 / Eurosensors XV, 11th International Conference on Solid
                       State Sensors and Actuators, Munich, Germany, June 10–14, 2001, Digest of Technical
                       Papers, Vol. 1, pp. 182–185.
                  [17] Sparks, D., et al., “Chip-Scale Packaging of Gyroscope Using Wafer Bonding,” Sensors and
                       Materials, Vol. 11, No. 4, 1999, pp. 197–207.
                  [18] Audet, S. A., and K. M. Edenfield, “Integrated Sensor Wafer Level Packaging,” Transduc-
                       ers ’97, 1997 International Conference on Solid State Sensors and Actuators, Chicago, IL,
                       June 16–19, 1997, Proceedings, Vol. 1, pp. 287–289.
                  [19] Krassow, H., F. Campabadal, and E. Lora-Tamayo, “Wafer Level Packaging of Silicon
                       Pressure Sensors,” Sensors and Actuators, Vol. A82, No. 1–3, May 2000, pp. 229–233.
   87   88   89   90   91   92   93   94   95   96   97