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Design and Application of Space-Based MEMS 339

TABLE 15.3
Environmental Effects and the Principal Failures Induced on MEMS Devices
Environment Principal Effects Typical Failures Induced

High temperature Thermal aging Insulation failure
Oxidation Alteration of electrical properties
Structural change Leaching of gold or other
materials into silicon substrate
Chemical reaction
Purple plague
Kirkendahl voids
Softening, melting, and Structural failure
sublimation
Viscosity reduction or Loss of lubrication properties
evaporation
Physical expansion Structural failure
Increased mechanical stress
Increased wear on moving parts
Low temperature Increased viscosity and Loss of lubrication properties
solidification
Ice formation Alteration of electrical properties
Embrittlement Loss of mechanical strength
Cracking, failure
Physical contraction Structural failure
Increased wear on moving parts
High relative humidity Moisture absorption Sealing, rupture of container
Chemical reaction
Physical breakdown
Corrosion
Loss of electrical strength
Electrolysis
Loss of mechanical strength
Interference with function
Loss of electrical properties
Increased conductivity of
insulators
Increased opportunity for failures
due to stiction
Low relative humidity Desiccation Loss of mechanical strength
Embrittlement Structural collapse
Granulation Alteration of electrical properties,
‘‘dusting.’’
Increased chance of ESD induced
failures
High pressure Compression Structural collapse
Penetration of sealing
Interference with function
Ruptures of fragile structures

Continued

© 2006 by Taylor & Francis Group, LLC