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                    Design and Application of Space-Based MEMS                      343


                    such effects be considered in determining the environmental strength for electronic
                    equipment that must achieve a specified reliability goal.
                       Electromagnetic radiation often produces interference and noise effects within
                    electronic circuitry, which can impair system performance. Sources of these effects
                    include corona or lightning discharges, sparking, and arcing phenomena. These may
                    be associated with high-voltage transmission lines, ignition systems, brush type
                    motors, and even the equipment itself. Generally, the reduction of interference
                    effects requires incorporating filtering and shielding features or specifying less
                    susceptible components and circuitry.
                       Nuclear radiation can cause permanent damage by alteration of the atomic or
                    molecular structure of dielectric and semiconductor materials. High-energy radi-
                    ation also can cause ionization effects that degrade the insulation levels of dielectric
                    materials. The migration of nuclear radiation effects typically involves materials
                    and parts possessing a higher degree of radiation resistance, and the incorporation of
                    shielding and hardening techniques.
                       Each environmental factor experienced by an item during its life cycle requires
                    consideration in the design process. This ensures that adequate environmental
                    strength is incorporated into the design for reliability.
                       In conclusion, failure to perform a detailed life cycle environment profile can
                    leadtooverlookingenvironmentalfactorswhoseeffectiscriticaltoMEMSreliability.
                    If these factors are not included in the environmental design criteria and test program,
                    environment-induced failures may occur during space flight operations. Therefore, it
                    is recommended that at the onset of the design process, researchers identify the
                    operating conditions that will be encountered during the life of the equipment.


                    15.5.6 ELECTRICAL STRESSES
                    Civilian and military space missions are susceptible to corona and high break-
                    down voltage. Understanding the role and the potential degradation caused by these
                    events is important for the MEMS designer. Historically, spacecrafts are vulnerable
                    to corona when exposed to regimes of critical pressure during ground test and
                    flight. NASA has encountered this problem many times. These coronal discharge
                    problems have occurred many times in NASA history and can cause serious damage
                    among craft components. Hardware susceptibility to corona-induced damage should
                    be addressed in subsystem design and in test and operational procedures.
                       Ionizing portion of the atmosphere may subject a spacecraft to unequal flux of
                    ions and electrons that can induce a charge. In low-earth orbit (LEO) a
                    spacecraft travels through dense but low energy plasmas and the spacecrafts are
                    negatively charged and may charge to thousands of volts. In geostationary orbit
                    (GEO) there is a greater concern where biased surfaces, such as solar arrays, can
                    affect the floating potential. 29  Particular attention must be paid to prevent arcing to
                    MEMS devices if placed on the surface or skin of the satellite. Traditional ap-
                    proaches to assure that the surface of the satellite is conductive to bleed off charges
                    can be used with MEMS devices on the surfaces with a conductive plating or
                    coating depending on design and application.





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