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3-200 MEMS: Design and Fabrication

Guckel, H., Sniegowski, J.J., Christenson, T.R., Mohney, S., and Kelly, T.F. (1989) “Fabrication of
Micromechanical Devices from Polysilicon Films with Smooth Surfaces,” Sensor. Actuator. 20, pp.
117–21.
Guckel, H., Sniegowski, J.J., Christenson, T.R., and Raissi, F. (1990) “The Application of Fine-Grained,
Tensile Polysilicon to Mechanically Resonant Transducers,” Sensor. Actuator. A A21, pp. 346–51.
Hallas, C.E., “Electropolishing Silicon,” Solid State Technol. 14, pp. 30–32.
Hansen, K.M., Ji, H.-F., Wu, G., Datar, R., Cote, R., Majumdar, A., and Thundat, T. (2001) “Cantilever-
Based Optical Deflection Assay for Discrimination of DNA Single-Nucleotide Mismatches,” Anal.
Chem.
Harbeke, G., Krausbauer, L., Steigmeier, E.F., and Widmer, A.E. (1983) “LPCVD Polycrystalline Silicon:
Growth and Physical Properties of In-Situ Phosphorous Doped and Undoped Films,”RCA Rev. 44,
pp. 287–313.
Harley, J.A., and Kenny, T.W. (1999) “High-Sensitivity Cantilevers Under 1000Å Thick,” Appl. Phys. Lett.
75, pp. 289–91.
Harris, T.W. (1976) Chemical Milling, Clarendon Press, Oxford.
Hélin, P., Bourouina, T., Fujita, H., Maekoba, H., Cugat, O., and Reyne, G. (2000) “Self-Aligned Vertical
Mirrors and V-Grooves for Magnetic Micro Optical Matrix Switch,” in Nano et Micro Technologies,
D. Hauden, ed., Hermes Science Publications, pp. 55–87.
Heller, M.J., Forster, A.H., and Tu, E. (2000) “Active Microelectronic Chip Devices which Utilize
Controlled Electrophoretic Fields for Multiplex DNA Hybridization and Other Genomic
Applications,” Electrophoresis 21, pp. 157–64.
Hendriks, M., Delhez, R., and Radelaar, S. (1983) “Carbon Doped Polycrystalline Silicon Layers,” Studies
in Inorganic Chemistry, Elsevier, Amsterdam, p. 193.
Hendriks, M., and Mavero, C. (1991) “Phosphorous Doped Polysilicon for Double Poly Structures: Part 1.
Morphology and Microstructure,” J. Electrochem. Soc. 138, pp. 1466–70.
Herb, J.A., Peters, M.G., Terry, S.C., and Jerman, J.H. (1990) “PECVD Diamond Films for Use in Silicon
Microstructures,” Sensor. Actuator. A A23, pp. 982–87.
Hermansson, K., Lindberg, U., Hok, B., and Palmskog, G. (1991) “Wetting Properties of Silicon Surfaces,”
in 6th International Conference on Solid-State Sensors and Actuators (Transducers ’91), San Francisco
pp. 193–96.
Herr, E., and Baltes, H. (1991) “KOH Etch Rates of High-Index Planes from Mechanically Prepared Silicon
Crystals,” in 6th International Conference on Solid-State Sensors and Actuators (Transducers ’91), San
Francisco, pp. 807–10.
Hesketh, P.J., Ju, C., Gowda, S., Zanoria, E., and Danyluk, S. (1993) “Surface Free Energy Model of Silicon
Anisotropic Etching,” J. Electrochem. Soc. 140, pp. 1080–85.
Heuberger, A. (1989) Mikromechanik, Springer Verlag, Heidelberg.
Hirata, M., Suzuki, K., and Tanigawa, H. (1988) “Silicon Diaphragm Pressure Sensors Fabricated by
Anodic Oxidation Etch-Stop,” Sensor. Actuator. 13, pp. 63–70.
Hjort, K., Schweitz, J.-Å., Andersson, S., Kordina, O., and Janzen, E. (1992) “Epitaxial Regrowth in Surface
Micromachining of GaAs,” in Proceedings: IEEE Micro Electro Mechanical Systems (MEMS ’92),
Travemunde, Germany, pp. 83–86.
Hjort, K., Schweitz, J.-Å., and Hok, B. (1990) “Bulk and Surface Micromachining of GaAs Structures,” in
Proceedings: IEEE Micro Electro Mechanical Systems (MEMS ’90), Napa Valley, CA, pp. 73–76.
Hoffman, E., Warneke, B., Kruglick, E., Weigold, J., and Pister, K.S.J. (1995) “3D Structures with
Piezoresistive Sensors in Standard CMOS,” in Proceedings: IEEE Micro Electro Mechanical Systems
(MEMS ’95), Amsterdam, pp. 288–93.
Hoffman, R.W. (1975) “Stresses in Thin Films: The Relevance of Grain Boundaries and Impurities,” Thin
Solid Films 34, pp. 185–90.
Hoffman, R.W. (1976) “Mechanical Properties of Non-Metallic Thin Films,” in Physics of Nonmetallic
Thin Films (NATO Advanced Study Institutes Series: Series B, Physics), Dupuy, C.H.S., and Cachard,
A.A., eds., Plenum Press, New York, pp. 273–353.

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