Page 249 -

3-204 MEMS: Design and Fabrication

Lepselter, M.P. (1966) “Beam Lead Technology,” Bell. Sys. Tech. J. 45, pp. 233–54.
Lepselter, M.P. (1967) “Integrated Circuit Device and Method,” U.S. Patent 3,335,338.
Levy, R.A., and Nassau, K. (1986) “Viscous Behavior of Phosphosilicate and Borophosphosilicate Glasses
in VLSI Processing,” Solid State Technol. October pp. 123–30.
Levy-Clement, C., Lagoubi, A., Tenne, R., and Neumann-Spallart, M. (1992) “Photoelectrochemical
Etching of Silicon,” Electrochim. Acta 37, pp. 877–88.
Lewerenz, H.J., Stumper, J., and Peter, L.M. (1988) “Deconvolution of Charge Injection Steps in Quantum
Yield Multiplication on Silicon,” Phys. Rev. Lett. 61, pp. 1989–92.
Li, G., Hubbard, T., and Antonsson, E.K. (1998) “EGS: On-line WWW Wet Etch Simulator,” presented at
IEEE MSM ’98, Santa Clara, CA..
Lietoila, A., Wakita, A., Sigmon, T.W., and Gibbons, J.F. (1982) “Epitaxial Regrowth of Intrinsic, 31P-
Doped and Compensated (31P 11B-Doped) Amorphous Si,” J. Appl. Phys. 53, pp. 4399–405.
Lin, G., Pister, K.S.J., and Roos, K.P. (1996) “Standard CMOS Piezoresistive Sensor to Quantify Heart Cell
Contractile Forces,” in Ninth Annual International Workshop on Micro Electro Mechanical Systems
(MEMS ’96), San Diego, pp. 150–55.
Lin, L. (1993) Selective Encapsulations of MEMS: Micro Channels, Needles, Resonators, and
Electromechanical Filters, Ph.D. thesis, University of California, Berkeley.
Lin, L., Howe, R.T., and Pisano, A.P. (1993) “A Novel In Situ Micro Strain Gauge,” in Proceedings: IEEE
Micro Electro Mechanical Systems (MEMS ’93), Fort Lauderdale, pp. 201–6.
Lin, L.Y., Lee, S.S., Wu, M.C., and Pister, K.S.J. (1995) “Micromachined Integrated Optics for Free-Space
Interconnections,” in Proceedings: IEEE Micro Electro Mechanical Systems (MEMS ’95), Amsterdam,
pp. 77–82.
Lin, T.-H. (1996) “Flexure-Beam Micromirror Devices and Potential Expansion for Smart
Micromachining,” in Smart Electronics and MEMS (Proceedings of the SPIE), San Diego, pp. 20–29.
Lin, V.S., Motesharei, K., Dancil, K.S., Sailor, M.J., and Ghadiri, M.R. (1997) “A Porous Silicon-Based
Optical Interferometric Biosensor,” Science 278, 840–43.
Linde, H., and Austin, L. (1992) “Wet Silicon Etching with Aqueous Amine Gallates,” J. Electrochem. Soc.
139, pp. 1170–74.
Liu, J., Tai, Y.-C., Lee, J., Pong, K.-C., Zohar, Y., and Ho, C.-H. (1993) “In Situ Monitoring and Universal
Modeling of Sacrificial PSG Etching Using Hydrofluoric Acid,” in Proceedings: Micro Electro
Mechanical Systems (MEMS ’93), Fort Lauderdale, pp. 71–6.
Lober, T.A., and Howe, R.T. (1988a) “Surface Micromachining for Electrostatic Microactuator Fabrication,”
in Technical Digest: 1988 Solid State Sensor and Actuator Workshop, Hilton Head Island, SC.
Lober, T.A., Huang, J., Schmidt, M.A., and Senturia, S.D. (1988b) “Characterization of the Mechanisms
Producing Bending Moments in Polysilicon Micro-Cantilever Beams by Interferometric Deflection
Measurements,” in Technical Digest: 1988 Solid State Sensor and Actuator Workshop, Hilton Head
Island, SC, pp. 92–95.
Lochel, B., Maciossek,A., Quenzer, H.J., and Wagner, B. (1994) “UV Depth Lithography and Galvanoforming
for Micromachining,” in Electrochemical Microfabrication 2, Miami Beach, pp. 100–11.
Lochel, B., Maciossek, A., Quenzer, H.J., and Wagner, B. (1996a) “Ultraviolet Depth Lithography and
Galvanoforming for Micromachining,” J. Electrochem. Soc. 143, pp. 237–44.
Lochel, B., Rothe, M., Fehlberg, S., Gruetzner, G., and Bleidiessel, G. (1996b) “Influence of Resist Baking
on the Pattern Quality of Thick Photoresists,”in SPIE-Micromachining and Microfabrication Process
Technology 2, Austin, pp. 174–81.
Long, M.K., Burdick, J.W., and Antonsson, E.K. (1999) “Design of Compensation Structures for
Anisotropic Etching,” presented at MSM ’99: Modeling and Simulation of Microsystems,
Semiconductors, Sensors and Actuators, San Juan, Puerto Rico.
Luder, E. (1986) “Polcrystalline Silicon-Based Sensors,” Sensor. Actuator. 10, pp. 9–23.
MacDonald, N.C., Chen, L.Y., Yao, J.J., Zhang, Z.L., McMillan, J.A., Thomas, D.C., and Haselton, K.R.
(1989) “Selective Chemical Vapor Deposition of Tungsten for Microelectromechanical Structures,”
Sensor. Actuator. 20, pp. 123–33.

© 2006 by Taylor & Francis Group, LLC