Page 247 -
P. 247
3-202 MEMS: Design and Fabrication
Joseph, J., Madou, M., Otagawa, T., Hesketh, P., and Saaman, A. (1989) “Catheter-Based Micromachined
Electrochemical Sensors,” in Catheter-Based Sensing and Imaging Technology (Proceedings of the
SPIE), Los Angeles, pp. 18–22.
Judy, M.W., Cho, Y.H., Howe, R.T., and Pisano, A.P. (1991) “Self-Adjusting Microstructures (SAMS),” in
Proceedings: IEEE Micro Electro Mechanical Systems (MEMS ’91), Nara, Japan, pp. 51–56.
Judy, M.W., and Howe, R.T. (1993a) “Hollow Beam Polysilicon Lateral Resonators,” in Proceedings: IEEE
Micro Electro Mechanical Systems (MEMS ’93), Fort Lauderdale, pp. 265–71.
Judy, M.W., and Howe, R.T. (1993b) “Highly Compliant Lateral Suspensions Using Sidwall Beams,” in
7th International Conference on Solid-State Sensors and Actuators (Transducers ’93), Yokohama,
pp. 54–57.
Jung, K.H., Shih, S., and Kwong, D.L. (1993) “Developments in Luminescent Porous Si,” J. Electrochem.
Soc. 140, pp. 3046–64.
Kahn, H., Stemmer, S., Nandakumar, K., Heuer, A.H., Mullen, R.L., Ballarini, R., and Huff, M.A. (1996)
“Mechanical Properties of Thick, Surface Micromachined Polysilicon Films,” Ninth Annual
International Workshop on Micro Electro Mechanical Systems (MEMS ’96), San Diego, pp. 343–48.
Kamins, T. (1988) Polycrystalline Silicon for Integrated Circuits, Kluwer, Boston.
Kaminsky, G. “Micromachining of Silicon Mechanical Structures,” J. Vac. Sci. Technol. B3, pp. 1015–24.
Kanda, Y. (1982) “A Graphical Representation of the Piezoresistance Coefficients in Silicon,” IEEE Trans.
Electron Devices ED-29, pp. 64–70.
Kanda, Y. (1991) “What Kind of SOI Wafers Are Suitable for What Type of Micromachining Purposes?”
in 6th International Conference on Solid-State Sensors and Actuators (Transducers ’91), San
Francisco, pp. 452–55.
Karam, J.M., Courtois, B., Holjo, M., Leclercq, J.L., and Viktorotovitch, P. (1996) “Collective Fabrication
of Gallium Arsenide Based Microsystems,” in SPIE: Micromachining and Microfabrication Process
Technology 2, Austin, pp. 315–24.
Keller, C., and Ferrari, M. (1994) “Milli-Scale Polysilicon Structures,” in Technical Digest: 1994 Solid State
Sensor and Actuator Workshop, Hilton Head Island, SC, pp. 132–37.
Keller, C.G., and Howe, R.T. (1995) “Hexsil Bimorphs for Vertical Actuation,” in 8th International
Conference on Solid-State Sensors and Actuators (Transducers ’95), Stockholm, pp. 99–102.
Keller, C.G., and Howe, R.T. (1995) “Nickel-Filled Hexsil Thermally Actuated Tweezers,”in 8th International
Conference on Solid-State Sensors and Actuators (Transducers ’95), Stockholm, pp. 376–79.
Kendall, D.L. (1975) “On Etching Very Narrow Grooves in Silicon,” Appl. Phys. Lett. 26, pp. 195–98.
Kendall, D.L. (1979) “Vertical Etching of Silicon at Very High Aspect Ratios,” Ann. Rev. Mater. Sci. 9, pp.
373–403.
Kendall, D.L., and Guel, G.R. (1985) “Orientation of the Third Kind: The Coming of Age of (110) Silicon,”in
Micromachining and Micropackaging of Transducers, Fung, C.D. ed., Elsevier, New York, pp. 107–24.
Kenney, D.M. (1967) “Methods of Isolating Chips of a Wafer of Semiconductor Material,” U.S. Patent
3,332,137.
Kern, W. (1978) “Chemical Etching of Silicon, Germanium, Gallium Arsenide, and Gallium Phosphide,”
RCA Rev. 39, pp. 278–308.
Kern, W., and Deckert, C.A. (1978) “Chemical Etching,” in Thin Film Processes, Vossen, J.L., and Kern, W.,
eds., Academic Press, Orlando.
Khazan, A.D. (1994) Transducers and Their Elements, PTR Prentice Hall, Englewood Cliffs, NJ.
Kim, B., and Dong-II, D.C. (1998) “Aqueous KOH Etching of Silicon (110): Etch Characteristics and
Compensation Methods for Convex Corners,” J. Electrochem. Soc. 145, p. 2499.
Kim, C.J. (1991) Silicon Electromechanical Microgrippers: Design, Fabrication, and Testing, Ph.D. thesis,
University of California, Berkeley.
Kim, S.C., and Wise, K. (1983) “Temperature Sensitivity in Silicon Piezoresistive Pressure Transducers,”
IEEE Trans. Electron Devices ED-30, pp. 802–10.
Kim, Y.W., and Allen, M.G. (1991) “Surface Micromachined Platforms Using Electroplated Sacrificial
Layers,” in 6th International Conference on Solid-State Sensors and Actuators (Transducers ’91), San
Francisco, pp. 651–54.
© 2006 by Taylor & Francis Group, LLC