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9.9  Development of Microstructure in Isomorphous Alloys  •  311

                                                                         Figure 9.5  Schematic representation
                               L                                         of the development of microstructure
                                                L                        during the nonequilibrium solidification
                                              (35 Ni)                    of a 35 wt% Ni–65 wt% Cu alloy.
                                  L (35 Ni)
                 1300     (46 Ni)        a                + L




                                           b
                                 L(29 Ni)     (40 Ni)   (46 Ni)
                                         c
               Temperature (°C)  L(21 Ni)  d      (42 Ni)  L(29 Ni)   (40 Ni)
                            L(24 Ni)
                                                              (46 Ni)
                                    (35 Ni)
                                           e     (38 Ni)
                 1200
                                      (31 Ni)
                                                             L (24 Ni)
                                            f
                                                               (46 Ni)
                                                               (40 Ni)
                                       (46 Ni)                 (35 Ni)
                                       (40 Ni)
                                                         L (21 Ni)
                                       (35 Ni)
                                                           (46 Ni)
                                       (31 Ni)             (40 Ni)
                                                           (35 Ni)
                                                           (31 Ni)
                 1100
                         20         30         40         50         60
                                       Composition (wt% Ni)




                                 phase that solidified is 40 wt% Ni–60 wt% Cu [a(40 Ni)]. However, because diffu-
                                 sion in the solid a phase is relatively slow, the a phase that formed at point b¿ has not
                                 changed composition appreciably—that is, it is still about 46 wt% Ni—and the compo-
                                 sition of the a grains has continuously changed with radial position, from 46 wt% Ni at
                                 grain centers to 40 wt% Ni at the outer grain perimeters. Thus, at point c¿, the average
                                 composition of the solid a grains that have formed would be some volume-weighted
                                 average composition lying between 46 and 40 wt% Ni. For the sake of argument, let us
                                 take this average composition to be 42 wt% Ni–58 wt% Cu [a(42 Ni)]. Furthermore,
                                 we would also find that, on the basis of lever-rule computations, a greater proportion
                                 of liquid is present for these nonequilibrium conditions than for equilibrium cooling.
                                 The implication of this nonequilibrium solidification phenomenon is that the solidus
                                 line on the phase diagram has been shifted to higher Ni contents—to the average com-
                                 positions of the a phase (e.g., 42 wt% Ni at 1240 C)—and is represented by the dashed
                                 line in Figure 9.5. There is no comparable alteration of the liquidus line inasmuch as it
                                 is assumed that equilibrium is maintained in the liquid phase during cooling because of
                                 sufficiently rapid diffusion rates.
                                    At point d¿ (~1220 C) and for equilibrium cooling rates, solidification should be
                                 completed. However, for this nonequilibrium situation, there is still an appreciable
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