Page 431 - Mechanical Engineers' Handbook (Volume 4)

420 Cooling Electronic Equipment

57. A. Bilitzky, The Effect of Geometry on Heat Transfer by Free Convection from a Fin Array, Thesis,
Department of Mechanical Engineering, Ben-Gurion University of the Negev, Beer Sheva, Israel,
1986.
58. M. G. Cooper, B. B. Mikic, and M. M. Yovanovich, ‘‘Thermal Contact Resistance,’’ Int. J. Heat
Mass Transfer 12, 279–300 (1969).
59. M. M. Yovanovich and V. W. Antonetti, ‘‘Application of Thermal Contact Resistance Theory to
Electronic Packages,’’ in A. Bar-Cohen and A. D. Kraus, (eds.), Advances in Thermal Modeling of
Electronic Components and Systems, Vol. 1, Hemisphere, New York, 1988.
60. H. J. Sauer, Jr., ‘‘Comparative Enhancement of Thermal Contact Conductance of Various Classes of
Interstitial Materials, NSF/DITAC Workshop, Melbourne, Monash University, Victoria, Australia,
1992, pp. 103–115.
61. L. S. Fletcher, ‘‘A Review of Thermal Control Materials for Metallic Junctions,’’ J. Spacecrafts
Rockets 849–850 (1972).
62. R. S. Prasher, ‘‘Surface Chemistry and Characteristics Based Model for the Contact Resistance of
Polymeric Interstitial Thermal Interface Materials,’’ J. Heat Transfer 123 (2001).